Provided is a cable device having an improved electromagnetic interference (EMI) shielding performance. The cable device includes: a cable including an optical fiber; a connector including a printed circuit board connected to the cable and including a ground electrode, and a conductive case; a connecting member provided around a connection between the cable and the connector; and a metal shell surrounding the cable inside of the connecting member, the metal shell being configured to shield electromagnetic interference of the cable and the connector.

An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

A high-speed transmission connector includes a connector housing with a slot, upper and lower plate portions facing each other across the slot, first and second contact rows arranged face to face with each other within the connector housing, first and second caps supported in a hole of the upper plate portion and the lower plate portion, respectively. Each contact of the first and second contact row includes a receiving portion to receive a header of an external communication device. The receiving portion includes a receiving tip end portion facing an insertion side of the header and a curved portion extending from a rear end of the receiving tip end portion and bent in an arch shape.

A material for blocking crosstalk, an optical assembly, and a method for preparing the material are provided. The optical assembly includes an optical receive assembly, where a periphery of the optical receive assembly includes a transparent region and a non-transparent region; the transparent region is made of the material, where a first layer of film is located on a side opposite to an optical receiving direction, and a second layer of film is located on a side opposite to the optical receive assembly; and the non-transparent region is of an electrical-signal shielding structure.

A semiconductor device includes a substrate having a first surface and a second surface that have top and back relation, an insulating layer formed on the first surface of the substrate, and an optical waveguide formed on the insulating layer and formed of a semiconducting layer. A first opening is formed on the second surface of the substrate. The first opening overlaps the optical waveguide in plan view.

A device includes a photonic integrated circuit (PIC) die and an electronic integrated circuit (EIC) die bonded to the PIC die. The PIC die includes a waveguide layer including a waveguide and a grating coupler configured to couple incident light into the waveguide, and a first set of dielectric layers on the waveguide layer. The EIC die includes a semiconductor substrate and a second set of dielectric layers on the semiconductor substrate. The first set of dielectric layers faces the second set of dielectric layers. The PIC die and the EIC die include a trench aligned with the grating coupler, the trench extending through the semiconductor substrate, the second set of dielectric layers, and the first set of dielectric layers to the waveguide layer such that the incident light may pass through the trench to reach the grating coupler. A multi-step dry etching process is used to form the trench.

A light emitting group is provided. The light emitting group includes at least two optical cables are adjacent to each other, wherein each optical cable respectively comprises a conductive material and a light guide material, wherein the light guide material covers the conductive material, and a plurality of encapsulated light emitting elements, wherein each optical cable corresponds to at least one encapsulated light emitting element, and the encapsulated light emitting elements are positioned at a terminal of each optical cable, wherein a minimum side of the encapsulated light emitting element is longer than a thickness of the light guide material, and a connecting line is connected with two centers of the two optical cables from a cross-sectional direction, and at least one encapsulated light emitting element overlaps with a perpendicular bisector in the connecting line.

A light emitting group is provided. The light emitting group includes at least two optical cables are adjacent to each other, wherein each optical cable respectively comprises a conductive material and a light guide material, wherein the light guide material covers the conductive material, and a plurality of encapsulated light emitting elements, wherein each optical cable corresponds to at least one encapsulated light emitting element, and the encapsulated light emitting elements are positioned at a terminal of each optical cable, wherein a minimum side of the encapsulated light emitting element is longer than a thickness of the light guide material, and a connecting line is connected with two centers of the two optical cables from a cross-sectional direction, and at least one encapsulated light emitting element overlaps with a perpendicular bisector in the connecting line.

This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.

This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.