A projection type transparent display includes a polarization modulator and a reflective layer. The polarization modulator is stacked in sequence by a linear polarizer, a liquid crystal layer and a phase retarder. The reflective layer is stacked on the phase retarder. A projection light is incident on the linear polarizer to form a linearly polarized light. The liquid crystal layer changes a polarization direction of the linearly polarized light. Two kinds of linearly polarized projection lights with polarization directions orthogonal to each other are respectively formed and pass through the phase retarder to respectively form two kinds of circularly polarized projection lights with opposite rotation directions. A background light is incident on the reflective layer. A circularly polarized background light with the same spiral direction is reflected, and the circularly polarized background light opposite to the spiral direction passes through the reflective layer and is incident on the polarization modulator.

The disclosure provides a flexible display device. The flexible display device includes a first flexible substrate, a light conversion structure and a touch electrode. The light conversion structure and the touch electrode are disposed on the first flexible substrate.

The disclosure provides a flexible display device. The flexible display device includes a first flexible substrate, a light conversion structure and a touch electrode. The light conversion structure and the touch electrode are disposed on the first flexible substrate.

The present invention belongs to the field of electronic display technology, and relates to a display plasma module and a manufacturing method thereof, characterized in that a display plasma module includes a pixel electrode and a transparent electrode located above the pixel electrode, characterized in that a display plasma is provided between the pixel electrode and the transparent electrode, and a spacer frame is located around the display plasma. In the present invention, the display plasma is used to replace the existing micro-cup structure or microcapsule. Compared to the traditional electrophoretic display screen with microstructure, the thickness is reduced, the contrast is increased by more than 10%, and the response time is reduced to less than 80 milliseconds, so that the manufacturing process is simpler, the yield is improved, and the manufacturing cost is reduced.

The present invention belongs to the field of electronic display technology, and relates to a display plasma module and a manufacturing method thereof, characterized in that a display plasma module includes a pixel electrode and a transparent electrode located above the pixel electrode, characterized in that a display plasma is provided between the pixel electrode and the transparent electrode, and a spacer frame is located around the display plasma. In the present invention, the display plasma is used to replace the existing micro-cup structure or microcapsule. Compared to the traditional electrophoretic display screen with microstructure, the thickness is reduced, the contrast is increased by more than 10%, and the response time is reduced to less than 80 milliseconds, so that the manufacturing process is simpler, the yield is improved, and the manufacturing cost is reduced.

A display panel structure includes an array substrate, a color filter substrate, and a liquid crystal layer. The array substrate includes a bonding area and a reinforcing device disposed between the bonding area and an edge of the array substrate. An adhesive layer is disposed on a surface of the reinforcing device corresponding to the array substrate. The reinforcing device provided as a dual reinforcing structure formed by the reinforcing glue, the retaining wall, and the base to effectively enhance structural strength around the bonding area of the array substrate.

A display panel structure includes an array substrate, a color filter substrate, and a liquid crystal layer. The array substrate includes a bonding area and a reinforcing device disposed between the bonding area and an edge of the array substrate. An adhesive layer is disposed on a surface of the reinforcing device corresponding to the array substrate. The reinforcing device provided as a dual reinforcing structure formed by the reinforcing glue, the retaining wall, and the base to effectively enhance structural strength around the bonding area of the array substrate.

An optical device (1), comprising: —a first optical transparent thermoplastic layer (2); —a second optical transparent thermoplastic layer (3), and; in between both thermoplastic layers (2, 3); • a diffractive optical element (4) adjacent to the first thermoplastic layer (2), • a spacer (5) in between the diffractive optical element (4) and the second thermoplastic layer (3), and; • a border (6) enclosing the diffractive optical element (4) thereby forming a sealed cavity (7); wherein at least an upper part of the border (6), adjacent to the cavity (7) is formed from an adhesive (15).

An optical device (1), comprising: —a first optical transparent thermoplastic layer (2); —a second optical transparent thermoplastic layer (3), and; in between both thermoplastic layers (2, 3); • a diffractive optical element (4) adjacent to the first thermoplastic layer (2), • a spacer (5) in between the diffractive optical element (4) and the second thermoplastic layer (3), and; • a border (6) enclosing the diffractive optical element (4) thereby forming a sealed cavity (7); wherein at least an upper part of the border (6), adjacent to the cavity (7) is formed from an adhesive (15).

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.