A metrology system includes a radiation source (708), a phased array (722a,b;724a,b;726;734), a detector, and a comparator. The phased array includes optical elements (706), waveguides (704), and phase modulators (702). The phased array generates a beam of radiation and directs the beam toward a surface of an object. The optical elements radiate radiation waves. The waveguides guide radiation from the radiation source to the optical elements. The phase modulators adjust phases of the radiation waves such that the radiation waves combine to form the beam. The detector receives radiation scattered from the surface and generates a detection signal based on the received radiation. The comparator analyzes the detection signal and determines a location of a defect on the surface based on the analyzing.

A system and method are disclosed for generating metrology measurements with second sub-system such as an optical sub-system. The method may include performing a training and a run-time operation. The training may include receiving first metrology data for device features from the first metrology sub-system (e.g., optical); generating first metrology measurements (e.g., critical dimensions, etc.); binning the device features into two or more device bins based on the first metrology measurements; and identifying representative metrology targets for the two or more device bins based on distributions of the first metrology measurements. The run-time operation may include receiving run-time metrology data (e.g., optical) of the representative metrology targets; and generating run-time metrology measurements based on the run-time metrology data.

Proactive management of semiconductor substrate tools. A machine learning model is used to predict future performance characteristics for such tools. In some examples, the model can diagnose issues with tools or with ambient conditions of the tools' environment. In some examples, the model can recommend one or more remedial actions to maintain adequate performance of the substrate tool.

A photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.

An overlay measurement device includes a light source configured to direct an illumination to an overlay measurement target in which a first overlay key in a first layer and a second overlay key in a second layer are positioned, the second layer being stacked on an upper portion or a lower portion of the first layer, a lens assembly including an objective lens configured to condense the illumination on a measurement position of at least one point in the overlay measurement target and a lens focus actuator configured to control a distance between the objective lens and the overlay measurement target, and a detector configured to acquire a focus image at the measurement position based on a beam reflected on the measurement position.

To improve quality assurance and durability of coated components, a multifaceted inspection coupon is provided that includes opposing flat surfaces, separated by sides which include one or more curves or fillets representing surfaces of the coated components to be inspected. The inspection coupon is coated on all sides in the same manner as the components to be inspected, whereby later analysis of the coupon provides quality assurance of all coated surfaces of the components at once.

A metrology system comprises a radiation source, an optical element, first and second detectors, an integrated optical device comprising a multimode waveguide, and a processor. The radiation source generates radiation. The optical element directs radiation toward a target to generate scattered radiation from the target. The first detector receives a first portion of the scattered radiation and generates a first detection signal based on the received first portion. The multimode waveguide interferes a second portion of the scattered radiation using modes of the multimode waveguide. The second detector receives the interfered second portion and generates a second detection signal based on the received interfered second portion. The processor receives the first and second detection signals. The processor analyzes the received first portion, the received interfered second portion, and a propagation property of the multimode waveguide. The processor determines the property of the target based on the analysis.

A method for determining parameters of an imaging transfer function (point spread function) is presented. With regard to a model that describes the imaging transfer function including a number of model parameters, a test substrate is exposed and developed using a test pattern which comprises multiple sub-patterns that are based on the same sub-pattern template but with varying control width of a feature in the template, such as the width of a line or a distance between lines. On the test substrate, isofocal dose measurements are performed using the structures thus formed on a test substrate with varying control and imaging parameters. The isofocal dose thus determined are utilized to determine the model parameters of the imaging transfer function.

Devices and processes for managing electrostatic charge on lithographic photomasks for semiconductor fabrication are provided. Exemplary devices include sensors for measuring the electrostatic charge on a lithographic photomask and charge injectors for modifying the electrostatic charge on a lithographic photomask. Exemplary devices are capable of attaching to carriers for lithographic photomasks. Exemplary processes include measuring the electrostatic charge on a lithographic photomask, calculating the amount that the electrostatic charge should be increased or decreased, and modifying the amount of electrostatic charge.

A method of calibrating a model for inferring a value for a parameter of interest from a measurement signal including obtaining a first set of metrology signals, corresponding known reference values for the parameter of interest; and at least first and second constraining sets of metrology signals relating to the same application as the first set of metrology signals. The first set of metrology signals and corresponding reference data is used to train at least one model to infer a value for the parameter of interest from the first set of metrology signals subject to a constraint that a difference between first inferred values for the parameter of interest using the model on at least the first constraining set of metrology signals and second inferred values for the parameter of interest using the model on the second constraining set of metrology signals is below a threshold value.