G03F7/70891

Method of reducing effects of lens heating and/or cooling in a lithographic process

A lithographic apparatus comprising a projection system comprising at least one optical component and configured to project a pattern onto a substrate. The lithographic apparatus further comprises a control system arranged to reduce the effects of heating and/or cooling of an optical component in a lithographic process. The control system is configured at least: to select at least one of a plurality of mode shapes to represent a relationship between at least one input in the lithographic process and an aberration resulting from the input and to generate and apply a correction to the lithographic apparatus based on the mode shape.

TEMPERATURE CONTROL DEVICE AND TEMPERATURE CONTROL METHOD
20230100048 · 2023-03-30 ·

A temperature control device and a temperature control method are provided. The temperature control device is located at an interface between a photoresist coating and developing machine and a lithography machine and includes: a temperature detection device, a gas flow generator and a controller. The temperature detection device and the gas flow generator are respectively connected to the controller. The temperature detection device is configured to detect an actual temperature at the interface in real time. The gas flow generator is at least configured to generate a gas flow sealing knife around the interface. The controller is configured to control the gas flow generator to generate the gas flow sealing knife responsive to that the actual temperature detected by the temperature detection device is not equal to the target temperature, to control the actual temperature at the interface to reach the target temperature through the gas flow sealing knife.

TEMPERATURE CONDITIONING SYSTEM

A passive flow induced vibration reduction system for use in a temperature conditioning system that controls the temperature of at least one component within a lithographic apparatus. This FIV reduction system includes: a conduit that provides a flow path for a liquid through the system; a liquid filled cavity in fluid connection with the conduit, wherein the fluid connection is provided via one or more openings in the wall of the conduit; a membrane configured such that it separates the liquid in the liquid filled cavity from a gas at a substantially ambient pressure and the membrane is configured such that compliance of the membrane reduces at least low frequency flow induced vibrations in the liquid flowing through the conduit; and an end-stop located on the gas side of the membrane, wherein the end-stop is configured to limit an extent of deflection of the membrane.

CONTAMINATION TRAP

A contamination trap for use in a debris mitigation system of a radiation source, the contamination trap comprising a plurality of vanes configured to trap fuel debris emitted from a plasma formation region of the radiation source; wherein at least one vane or each vane of the plurality of vanes comprises a material comprising a thermal conductivity above 30 W m.sup.−1 K.sup.−1.

Exposure apparatus and method of manufacturing article
11487212 · 2022-11-01 · ·

The present invention provides an exposure apparatus that exposes a substrate, comprising: an optical system configured to emit, in a first direction, light for exposing the substrate; a first supplier configured to supply a gas into a chamber where the optical system is arranged; and a second supplier configured to supply a gas to an optical path space where the light from the optical system passes through, wherein the second supplier includes a gas blower including a blowing port from which a gas is blown out in a second direction, and the guide member configured to guide the gas blown out from the blowing port to the optical path space, and the guide member includes a plate member extended on a side of the first direction of the blowing port so as to be arranged along the second direction.

MIRROR, IN PARTICULAR FOR MICROLITHOGRAPHY
20230088791 · 2023-03-23 ·

A mirror including a substrate (110), a reflection layer system (120), and at least one continuous piezoelectric layer (130, . . . ) arranged between the substrate and the layer system. An electric field producing a locally variable deformation is applied to the piezoelectric layer via a first, layer-system-side electrode arrangement and a second, substrate-side electrode arrangement. At least one of the electrode arrangements is assigned a mediator layer (170) setting an at least regionally continuous profile of the electrical potential along the respective electrode arrangement. The electrode arrangement to which the mediator layer is assigned has a plurality of electrodes (160, . . . ), each of which is configured to receive an electrical voltage relative to the respective other electrode arrangement. In the region that couples two respectively adjacent electrodes, the mediator layer is subdivided into a plurality of regions (171, . . . ) that are electrically insulated from one another.

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

An exposure tool is configured to remove contaminants and/or prevent contamination of mirrors and/or other optical components included in the exposure tool. In some implementations, the exposure tool is configured to flush and/or otherwise remove contaminants from an illuminator, a projection optics box, and/or one or more other subsystems of the exposure tool using a heated gas such as ozone (O.sub.3) or extra clean dry air (XCDA), among other examples. In some implementations, the exposure tool is configured to provide a gas curtain (or gas wall) that includes hydrogen (H.sub.2) or another type of gas to reduce the likelihood of contaminants reaching the mirrors included in the exposure tool. In this way, the mirrors and one or more other components of the exposure tool are cleaned and maintained in a clean environment in which radiation absorbing contaminants are controlled to increase the performance of the exposure tool.

DEVICE AND METHOD FOR CONTROLLING THE TEMPERATURE OF ELEMENTS IN MICRO-LITHOGRAPHIC PROJECTION EXPOSURE SYSTEMS
20230082054 · 2023-03-16 ·

A micro-lithographic projection exposure system comprises an illumination unit and a projection lens with at least one element which is penetrated at least in regions by a temperature-control fluid line provided for conducting a temperature-control fluid for controlling the temperature of the element. The temperature-control fluid line is connected to a temperature-control fluid storage container. A temperature-control element for controlling the temperature of the temperature-control fluid is provided on or in the temperature-control fluid line. At least two of the elements are independently penetrated by a respective separate at least one of temperature-control fluid lines, or at least two different regions of the at least one element are penetrated independently by a respective separate at least one of the temperature-control fluid lines, or at least two of the elements are penetrated by the temperature-control fluid line. A corresponding method is provided.

PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY WITH A VIBRATION DAMPER AND METHOD FOR DESIGNING A VIBRATION DAMPER
20230081234 · 2023-03-16 ·

A projection exposure apparatus has a vibration damper with a holder and a mass that is connected to the holder via a damping element. The vibration damper comprises a temperature control device for the temperature control of the damping element. The disclosure also relates to a method for designing a vibration damper.

Lithography Apparatus and Method

In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.