Patent classifications
G06F1/3296
Method to charge battery and electronic device including battery
Disclosed is an electronic device. The electronic device includes a battery, a charging part configured to be connectable to an external charging device to charge the battery, a memory, and a processor operatively connected to the charging part and the memory. The processor may determine whether the charging part is connected to the external charging device, determine whether the electronic device moves and/or electronic device usage time information of a user, and reduce a voltage at which the battery enters supplementary charging to a second voltage lower than a first voltage which corresponds to a value stored in the memory, based on whether the electronic device moves and/or the electronic device usage time information. In addition, it is possible to implement various other embodiments understood through the disclosure.
Circuitry applied to multiple power domains
The present invention provides a circuitry applied to multiple power domains. An amplifier of the circuitry includes an output stage and a switching circuit. The output stage includes a first transistor and a second transistor, wherein the first transistor is coupled between a supply voltage and an output terminal, the second transistor is coupled between the output terminal and a ground voltage. The switching circuit is configured to choose a body of the first transistor from the supply voltage or a reference voltage.
Circuitry applied to multiple power domains
The present invention provides a circuitry applied to multiple power domains. An amplifier of the circuitry includes an output stage and a switching circuit. The output stage includes a first transistor and a second transistor, wherein the first transistor is coupled between a supply voltage and an output terminal, the second transistor is coupled between the output terminal and a ground voltage. The switching circuit is configured to choose a body of the first transistor from the supply voltage or a reference voltage.
Multi-die power management in SoCs
Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
Power setting adjustment in restricted airflow environment
One embodiment provides a method, including: detecting, based on at least one metric, that an information handling device is experiencing a restricted airflow condition; decreasing, responsive to the detecting, a system power setting of the information handling device during a duration of the restricted airflow condition; and restoring, subsequent to detecting that the information handling device is no longer experiencing the restricted airflow condition; the system power setting. Other aspects are described and claimed.
Apparatus and method to provide a thermal parameter report for a multi-chip package
In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.
Apparatus and method to provide a thermal parameter report for a multi-chip package
In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.
THERMAL MANAGEMENT IN HORIZONTALLY OR VERTICALLY STACKED DIES
A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.
Computing device and method
A computing device, comprising: a computing module, comprising one or more computing units; and a control module, comprising a computing control unit, and used for controlling shutdown of the computing unit of the computing module according to a determining condition. Also provided is a computing method. The computing device and method have the advantages of low power consumption and high flexibility, and can be combined with the upgrading mode of software, thereby further increasing the computing speed, reducing the computing amount, and reducing the computing power consumption of an accelerator.
Computing device and method
A computing device, comprising: a computing module, comprising one or more computing units; and a control module, comprising a computing control unit, and used for controlling shutdown of the computing unit of the computing module according to a determining condition. Also provided is a computing method. The computing device and method have the advantages of low power consumption and high flexibility, and can be combined with the upgrading mode of software, thereby further increasing the computing speed, reducing the computing amount, and reducing the computing power consumption of an accelerator.