A display driver integrated circuit (IC) includes a logic module sequentially issuing read commands including a first read command, a second read command succeeding the first read command, and a third read command succeeding the second read command, and memory modules connected in series with each other. A first memory module is connected to the logic module and is the closest memory module to the logic module. The first memory module receives the read commands, provide the first read command to a first memory of the first memory module, read first image data from the first memory in response to the first read command, and provide the first image data and first remaining read commands among the read commands to a second memory module which is connected to the first memory module and farther than the first memory module from the logic module.

Methods, systems, and devices for input/output line sharing for memory subarrays are described. I/O lines may be shared across subarrays, which may correspond to separate memory tiles. The sharing of I/O lines may allow an I/O line to carry data from one subarray in response to access commands associated with one address range, and to carry data from another subarray in response to access commands associated with another address range. In some cases, sense amplifiers and other components may also be shared across subarrays, including across subarrays in different banks. The sharing of I/O lines may, in some cases, support activating only a subset of subarrays in a bank when accessing data stored in the bank, which may provide power savings.

A display driver integrated circuit (IC) includes a logic module sequentially issuing read commands including a first read command, a second read command succeeding the first read command, and a third read command succeeding the second read command, and memory modules connected in series with each other. A first memory module is connected to the logic module and is the closest memory module to the logic module. The first memory module receives the read commands, provide the first read command to a first memory of the first memory module, read first image data from the first memory in response to the first read command, and provide the first image data and first remaining read commands among the read commands to a second memory module which is connected to the first memory module and farther than the first memory module from the logic module.

An integrated circuit (IC) includes a memory manager having a plurality of memory ports, each configured to communicate with a corresponding floating memory block. The IC includes a first interconnect for a first domain, wherein the first interconnect has a first set of fixed ports configured to communicate with memory blocks dedicated to the first domain and a first set of floating ports configured to communicate with the memory manager, and a second interconnect for a second domain, wherein the second interconnect has a second set of fixed ports configured to communicate with memory blocks dedicated to the second domain and a second set of floating ports configured to communicate with the memory manager. The memory manager is configured to allocate a first portion of the memory ports to the first set of floating ports and a second portion of the memory ports to the second set of floating ports.

A processing apparatus is described. The apparatus includes a plurality of processing cores, including a first processing core and a second processing core a first field programmable gate array (FPGA) coupled to the first processing core to accelerate execution of graphics workloads processed at the first processing core and a second FPGA coupled to the second processing core to accelerate execution of workloads processed at the second processing core.

A memory system includes a first memory device having a first memory that includes a plurality of access management regions and a first access latency, each of the access management regions including a plurality of pages, the first memory device configured to detect a hot access management region having an access count that reaches a preset value from the plurality of access management regions, and detect one or more hot pages included in the hot access management region; and a second memory device having a second access latency that is different from the first access latency of the first memory device. Data stored in the one or more hot pages is migrated to the second memory device.

A mainboard includes a baseboard management controller (BMC), a plurality of dual in-line memory module (DIMM) slots, and a plurality of visual indicators each associated with a respective of the plurality of DIMM slots. The BMC is adapted to determine a DIMM population rule for populating the plurality of DIMM slots based on information relating to at least one DIMM, and the visual indicators are adapted to visually indicate a DIMM slot amongst the plurality of DIMM slots to which the at least one DIMM is to be installed in accordance with the DIMM population rule.

Transferring data between memories may include reading data associated with a memory transfer transaction from a first memory, determining whether a bypass indication associated with the memory transfer transaction is asserted, and transferring the data from the first memory to a second memory. The transferring may include bypassing the first-processing if the bypass indication is asserted. The transferring may further include bypassing second-processing the data if the bypass indication is asserted. Following bypassing the second-processing, the data may be stored in the second memory.

A processing element/unit can include a plurality of networks, a plurality of cores, crossbar interconnects, a plurality of memory controllers and local memory on an integrated circuit (IC) chip. The plurality of cores can be coupled together by the plurality of networks on chip. The crossbar interconnects can couple the networks of cores to the plurality of memory controllers. The plurality of memory controllers can be configured to access data stored in off-chip memory. The local memory can be configured to cache portions of the accessed data. The local memory can be directly accessible by the network of processing cores, or can be distributed across the plurality of memory controllers. The memory controllers can be narrow channel (NC) memory controllers having widths of 4, 8, 12, 16 or a multiple of 4 bits.

Some examples described herein relate to programmable devices that include a data processing engine (DPE) array that permits shifting of where an application is loaded onto DPEs of the DPE array. In an example, a programmable device includes a DPE array. The DPE array includes DPEs and address index offset logic. Each of the DPEs includes a processor core and a memory mapped switch. The processor core is programmable via one or more memory mapped packets routed through the respective memory mapped switch. The memory mapped switches in the DPE array are coupled together to form a memory mapped interconnect network. The address index offset logic is configurable to selectively modify which DPE in the DPE array is targeted by a respective memory mapped packet routed in the memory mapped interconnect network.