Provided is an electronic card and a manufacturing method therefor, and the electronic card may include: an electronic module which is configured to comprise an electronic circuit and a contact terminal on a thin film and comprises one or more electronic components; a lower core sheet which comprises an electronic module storage portion for storing the electronic module in a shape corresponding to an outer peripheral shape of the electronic module; and a middle core sheet which is stacked on the top of the lower core sheet storing the electronic module, comprises a component storage portion for storing some or all of the one or more electronic components provided in the electronic module, and is configured to have a sheet thickness equal to a thickness of a tallest component among the electronic components.

The present invention improves the communication characteristics of an inlay using an auxiliary antenna, while protecting the inlay from physical and mechanical external forces, shocks or the like, without being subjected to the constraints of a dipole antenna. To that end, the present invention has a configuration, including: an inlay having an IC chip and only a loop circuit antenna, on which the IC chip is mounted, and not including another antenna; a casing for accommodating the inlay therein; and a planar top cover covering one surface side of the casing. The top cover is formed of a prescribed metallic material and includes a cutout opening at least on one side. The inlay is disposed in the casing so as to be positioned inside the cutout. The top cover functions as an antenna of the inlay by being electrically connected to the inlay.

An apparatus and method for combined radio frequency identification (RFID)-based asset management and component authentication are provided. The apparatus comprises a plurality of components to be authenticated, a memory configured to store inventory data, a plurality of root-of-trust (RoT) integrated circuits (ICs), a wired communication bus, and a radio frequency identification (RFID) relay tag. Each RoT IC is mechanically coupled to a corresponding one of the plurality of components and configured to generate authentication data based on a unique key generated for authenticating the corresponding component. The RFID relay tag is connected to each of the RoT ICs via the wired communication bus and is configured to communicate with each of the RoT ICs via the wired communication bus and pass the authentication data and the inventory data to an RFID reader via a radio frequency signal to facilitate authentication of components and inventory management.

A card core includes a body defining a cutout and a discontinuity. The cutout includes an opening in the body defined by an edge and the discontinuity includes a channel defined by the body extending from an outer surface of the body to the cutout. At least one circuit element is positioned within the cutout. The cutout defines a size and geometry such that a gap is defined between the at least one circuit element and the edge to electromagnetically isolate the at least one circuit element from the body.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

The disclosure provides a method for forming an information carrying card or a core layer of an information carrying card using a radiation curing, and an apparatus configured to provide such a radiation curing. The method includes providing a carrier layer that defines at least one cavity, providing an inlay layer supporting at least one electronic component, and positioning at least a portion of the inlay layer in the at least one cavity. The method further comprises dispensing a radiation crosslinkable polymer composition over the inlay layer, and irradiating the radiation crosslinkable polymer composition.

Disclosed herein is a mounting system for a near field RF communications chip. The system comprises: (i) a substrate for carrying electronic components, and for providing electrical interconnections therebetween; (ii) a chip coupling carried by the substrate for connecting a near field RF communications chip (1001) to the mounting system; (iii) an auxiliary power provider (1003), separate from said near field RF communications chip, and adapted for providing electrical power output based on a received alternating electrical signal; (iv) an antenna coupling for connecting a near field RF communications antenna (1006) to said mounting system; and (v) a splitter (1005), for splitting alternating electrical signals.

A card core includes a body defining a cutout and a discontinuity. The cutout includes an opening in the body defined by an edge and the discontinuity includes a channel defined by the body extending from an outer surface of the body to the cutout. At least one circuit element is positioned within the cutout. The cutout defines a size and geometry such that a gap is defined between the at least one circuit element and the edge to electromagnetically isolate the at least one circuit element from the body.

Systems and methods for providing fraud prevention inserts in a chip pocket of a card are provided. A chip fraud prevention system includes a device including a chip and one or more fraud prevention inserts. The chip, and the fraud prevention inserts, may be at least partially encompassed in a chip pocket.

An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor.