Field-effect transistors, and methods of forming such field-effect transistors, including a gate dielectric overlying a semiconductor material, and a control gate overlying the gate dielectric, wherein the control gate includes an instance of a first polycrystalline silicon-containing material consisting essentially of polycrystalline silicon, and an instance of a second polycrystalline silicon-containing material selected from a group consisting of polycrystalline silicon-germanium and polycrystalline silicon-germanium-carbon.

Memory having a controller configured to cause the memory to determine a respective raw data value of a plurality of possible raw data values for each memory cell of a plurality of memory cells, count occurrences of each raw data value for a first set of memory cells of the plurality of memory cells, store a cumulative number of occurrences for each raw data value, determine a plurality of valleys of the stored cumulative number of occurrences for each raw data value with each valley corresponding to a respective raw data value of the plurality of possible raw data values, and, for each memory cell of a second set of memory cells of the plurality of memory cells, determine a data value for that memory cell in response to the raw data value for that memory cell and the respective raw data values of the plurality of valleys.

A memory device includes a bit line, a source line, a plurality of word lines, and a memory cell. The memory cell includes a plurality of memory strings coupled in parallel between the bit line and the source line. Each of the plurality of memory strings includes a plurality of memory elements coupled in series between the bit line and the source line, and electrically coupled correspondingly to the plurality of word lines.

An integrated circuit includes a memory array and a memory read circuitry for reading data from the memory array. The memory read circuitry includes a leakage current compensation circuit. The leakage current compensation circuit senses the leakage current in a bitline of the memory array during a read operation and generates a leakage compensation current to offset the leakage current during the read operation.

A memory device includes a semiconductor substrate, first and second regions in the substrate having a conductivity type different than that of the substrate, with a channel region in the substrate extending between the first and second regions. The channel region is continuous between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region. A second floating gate is disposed over and insulated from a second portion of the channel region. A first coupling gate is disposed over and insulated from the first floating gate. A second coupling gate is disposed over and insulated from the second floating gate. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. An erase gate is disposed over and insulated from the word line gate.

Charge pumps of integrated circuit devices might include an input configured to receive an internally-generated first voltage level, an output, and a plurality of stages between its input and output. A particular stage might include a voltage isolation device, a voltage driver, and a capacitance having a first electrode connected to an output of the voltage driver and a second electrode connected to the voltage isolation device. The voltage driver might be responsive to a clock signal and to a voltage level of the output of the voltage driver to selectively connect the output of the voltage driver to either a first voltage node configured to receive the first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, or a third voltage node configured to receive a third voltage level lower than the second voltage level.

A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Memory having an array of memory cells might include control logic configured to cause the memory to inhibit memory cells of a first subset of memory cells from programming during each programming pulse of a first plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of a second plurality of programming pulses, inhibit memory cells of a second subset of memory cells from programming during each programming pulse of the second plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of the first plurality of programming pulses, and enable memory cells of a third subset of memory cells for programming during at least one programming pulse of the first plurality of programming pulses and during at least one programming pulse of the second plurality of programming pulses.

Some embodiments include apparatuses, and methods of operating the apparatuses. Some of the apparatuses include a data line, a first memory cell string including first memory cells located in different levels of the apparatus, first access lines to access the first memory cells, a first select gate coupled between the data line and the first memory cell string, a first select line to control the first select gate, a second memory cell string including second memory cells located in different levels of the apparatus, second access lines to access the second memory cells, the second access lines being electrically separated from the first access lines, a second select gate coupled between the data line and the second memory cell string, a second select line to control the second select gate, and the first select line being in electrical contact with the second select line.

Field-effect transistors, and methods of forming such field-effect transistors, including a gate dielectric overlying a semiconductor material, and a control gate overlying the gate dielectric, wherein the control gate includes an instance of a first polycrystalline silicon-containing material consisting essentially of polycrystalline silicon, and an instance of a second polycrystalline silicon-containing material selected from a group consisting of polycrystalline silicon-germanium and polycrystalline silicon-germanium-carbon.