G11C16/0458

Memory device, integrated circuit device and method

A memory device includes a bit line, a source line, a plurality of word lines, and a memory cell. The memory cell includes a plurality of memory strings coupled in parallel between the bit line and the source line. Each of the plurality of memory strings includes a plurality of memory elements coupled in series between the bit line and the source line, and electrically coupled correspondingly to the plurality of word lines.

TWO-PART PROGRAMMING OF MEMORY CELLS

Memory having an array of memory cells might include control logic configured to cause the memory to program each memory cell of a plurality of memory cells whose respective data state is higher than or equal to a first particular data state of a plurality of data states while inhibiting programming of each memory cell of the plurality of memory cells whose respective data state is lower than the first particular data state, and program each memory cell of the plurality of memory cells whose respective data state is lower than or equal to a second particular data state of the plurality of data states after programming each memory cell of the plurality of memory cells whose respective data state is higher than or equal to the first particular data state.

SPLIT-GATE, 2-BIT NON-VOLATILE MEMORY CELL WITH ERASE GATE DISPOSED OVER WORD LINE GATE, AND METHOD OF MAKING SAME
20220101920 · 2022-03-31 ·

A memory device includes a semiconductor substrate, first and second regions in the substrate having a conductivity type different than that of the substrate, with a channel region in the substrate extending between the first and second regions. The channel region is continuous between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region. A second floating gate is disposed over and insulated from a second portion of the channel region. A first coupling gate is disposed over and insulated from the first floating gate. A second coupling gate is disposed over and insulated from the second floating gate. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. An erase gate is disposed over and insulated from the word line gate.

TERNARY CONTENT ADDRESSABLE MEMORY AND DECISION GENERATION METHOD FOR THE SAME

A TCAM comprises a plurality of first search lines, a plurality of second search lines, a plurality of memory cell strings and one or more current sensing units. The memory cell strings comprise a plurality of memory cells. Each of the memory cells is coupled to one of the first search lines and one of the second search lines. The current sensing units, coupled to the memory cell strings. In a search operation, a determination that whether any of the data stored in the memory cell strings matches a data string to be searched is made according to whether the one or more current sensing units detect current from the memory cell strings, or according to the magnitude of the current flowing out from the memory cell strings detected by the one or more current sensing units.

EEPROM cell and array having stacked nanosheet field effect transistors with a common floating gate

Semiconductor device, memory arrays, and methods of forming a memory cell include or utilize one or more memory cells. The memory cell(s) include a first nanosheet transistor connected to a first terminal, a second nanosheet transistor located on top of the first nanosheet transistor and connected in parallel to the first nanosheet transistor and connected to a second terminal, where the first and second nanosheet transistors share a common floating gate and a common output terminal, and an access transistor connected in series to the common output terminal and a low voltage terminal, the access transistor configured to trigger hot-carrier injection to the common floating gate to change a voltage of the common floating gate.

Apparatus for determining data states of memory cells

Memory having a controller configured to cause the memory to determine a plurality of activation voltage levels for the plurality of memory cells, determine a plurality of activation voltage level distributions based on a subset of the plurality of activation voltage levels with each of the activation voltage level distributions corresponding to a respective first subset of memory cells of a plurality of first subsets of memory cells of the plurality of memory cells, determine a plurality of transition voltage levels based on the plurality of activation voltage level distributions, and assign a respective data state of a plurality of data states to each memory cell of a second subset of memory cells of the plurality of memory cells based on the determined activation voltage of that memory cell and the determined plurality of transition voltage levels.

Content addressable memory device having electrically floating body transistor

A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Control gate structures for field-effect transistors
11121223 · 2021-09-14 · ·

Field-effect transistors, and apparatus including such field-effect transistors, including a gate dielectric overlying a semiconductor and a control gate overlying the gate dielectric. The control gate might include an instance of a first polycrystalline silicon-containing material containing polycrystalline silicon, and an instance of a second polycrystalline silicon-containing material containing polycrystalline silicon-germanium or polycrystalline silicon-germanium-carbon.

CONTROL GATE STRUCTURES FOR FIELD-EFFECT TRANSISTORS
20210151573 · 2021-05-20 · ·

Field-effect transistors, and apparatus including such field-effect transistors, including a gate dielectric overlying a semiconductor and a control gate overlying the gate dielectric. The control gate might include an instance of a first polycrystalline silicon-containing material containing polycrystalline silicon, and an instance of a second polycrystalline silicon-containing material containing polycrystalline silicon-germanium or polycrystalline silicon-germanium-carbon.

READ LATENCY REDUCTION FOR PARTIALLY-PROGRAMMED BLOCK OF NON-VOLATILE MEMORY
20210118510 · 2021-04-22 ·

Proactively adjusting read voltages at the system level, before performing a read operation on data located in a partially-programmed block in a block-addressable non-volatile memory, can significantly reduce the re-read trigger rate. This reduces the rate of entering a read recovery flow and subsequent read latency. Determining in advance a wordline-specific pattern of wordline offsets associated with past unsuccessful reads in partially-programmed blocks allows read voltages to be proactively adjusted for vulnerable wordlines. Read voltages are restored for subsequent read operations.