A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Non-volatile memory strings, which are coupled to respective bit lines and source lines, may include multiple non-volatile memory cells coupled to respective word lines. Multiple sensing operations may be used to determine data programmed into a particular non-volatile memory cell. For example, a control circuit may sense multiple values from a particular non-volatile memory cell included in a non-volatile memory string using different voltage levels on a source line coupled to the non-volatile memory string. The control circuit may select one of the multiple values based on a program state of a different non-volatile memory cell adjacent to the particular non-volatile memory cell.

A semiconductor memory device includes a memory cell array, a peripheral circuit, and a control logic. The memory cell array includes a plurality of memory blocks. The peripheral circuit performs a read operation on a selected memory block among the plurality of memory blocks. The control logic controls the read operation of the peripheral circuit. The selected memory block is coupled to a plurality of bit lines, and the plurality of bit lines are grouped into a plurality of bit line groups. The peripheral circuit performs data sensing by applying different reference currents to the plurality of bit line groups, respectively.

A memory arrangement having a memory cell array, wherein each column is associated with a bit line and each row is associated with a word line, wherein the columns have first columns of memory cells that store useful data, and columns of memory cells of a second column type that store prescribed verification data, wherein during a read access operation the memory cells of at least the columns of memory cells of the second column type set the associated bit line to a value that corresponds to a logic combination of the values stored by the memory cells of the column of the second column type that belong to rows of memory cells addressed during the read access operation, and a detection circuit that is configured to, during a read access operation, detect whether a bit line associated with a column of memory cells of the second column type is set to a value that corresponds to the logic combination of values stored by memory cells of the column of the second column type of memory cells and whose values belong to different rows of memory cells.

Semiconductor device, memory arrays, and methods of forming a memory cell include or utilize one or more memory cells. The memory cell(s) include a first nanosheet transistor connected to a first terminal, a second nanosheet transistor located on top of the first nanosheet transistor and connected in parallel to the first nanosheet transistor and connected to a second terminal, where the first and second nanosheet transistors share a common floating gate and a common output terminal, and an access transistor connected in series to the common output terminal and a low voltage terminal, the access transistor configured to trigger hot-carrier injection to the common floating gate to change a voltage of the common floating gate.

A method of reading a memory device having a plurality of memory cells by, and a device configured for, reading a first memory cell of the plurality of memory cells to generate a first read current, reading a second memory cell of the plurality of memory cells to generate a second read current, applying a first offset value to the second read current, and then combining the first and second read currents to form a third read current, and then determining a program state using the third read current. Alternately, a first voltage is generated from the first read current, a second voltage is generated from the second read current, whereby the offset value is applied to the second voltage, wherein the first and second voltages are combined to form a third voltage, and then the program state is determined using the third voltage.

A TCAM comprises a plurality of first search lines, a plurality of second search lines, a plurality of memory cell strings and one or more current sensing units. The memory cell strings comprise a plurality of memory cells. The current sensing units are coupled to the memory cell strings. In a search operation, a determination that whether any of the data stored in the memory cell strings matches a data string to be searched is made according to whether the one or more current sensing units detect current from the memory cell strings, or according to the magnitude of the current flowing out from the memory cell strings detected by the one or more current sensing units. Each memory cell includes a first transistor and a second transistor. Gates of the first and second transistors are coupled to a corresponding first search line and a corresponding second search line.

Memory having an array of memory cells might include control logic configured to cause the memory to program each memory cell of a plurality of memory cells whose respective data state is higher than or equal to a first particular data state of a plurality of data states while inhibiting programming of each memory cell of the plurality of memory cells whose respective data state is lower than the first particular data state, and program each memory cell of the plurality of memory cells whose respective data state is lower than or equal to a second particular data state of the plurality of data states after programming each memory cell of the plurality of memory cells whose respective data state is higher than or equal to the first particular data state.

A semiconductor memory device includes a memory cell array, a peripheral circuit, and a control logic. The memory cell array includes a plurality of memory blocks. The peripheral circuit performs a read operation on a selected memory block among the plurality of memory blocks. The control logic controls the read operation of the peripheral circuit. The selected memory block is coupled to a plurality of bit lines, and the plurality of bit lines are grouped into a plurality of bit line groups. The peripheral circuit performs data sensing by applying different reference currents to the plurality of bit line groups, respectively.

Various embodiments, disclosed herein, can include apparatus and methods to perform a one check failure byte (CFBYTE) scheme in programming of a memory device. In programming memory cells in which each memory cell can store multiple bits, the multiple bits being a n-tuple of bits of a set of n-tuples of bits with each n-tuple of the set associated with a level of a set of levels of threshold voltages for the memory cells. Verification of a program algorithm can be structured based on a programming algorithm that proceeds in a progressive manner by placing a threshold voltage of one level/distribution at a time. The routine of this progression can be used to perform just one failure byte check for that specific target distribution only, thus eliminating the need to check failure byte for all subsequent target distribution during every stage of program algorithm. Additional apparatus, systems, and methods are disclosed.