In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.

A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed.

According to one embodiment, a semiconductor memory device includes: a first delay circuit configured to delay a first signal and provide a variable delay time; a first select circuit configured to select a second signal or a third signal based on the first signal delayed by the first delay circuit; a first output buffer configured to output a fourth signal based on a signal selected by the first select circuit; a first output pad configured to externally output the fourth signal; and a counter configured to count a number of times the fourth signal is output.

Methods and apparatuses with counter-based reading are described. A memory cells of a codeword are accessed and respective voltages are generated. A reference voltage is generated and a logic state of each memory cell is determined based on the reference voltage and the respective generated cell voltage. The reference voltage is modified until a count of memory cells determined to be in a predefined logic state with respect to the last modified reference voltage value meets a criterium. In some embodiments the criterium may be an exact match between the memory cells count and an expected number of memory cells in the predefined logic state. In other embodiments, an error correction (ECC) algorithm may be applied while the difference between the count of cells in the predefined logic state and the expected number of cells in that state does not exceed a detection or correction power of the ECC.

Methods and apparatuses with counter-based reading are described. A memory cells of a codeword are accessed and respective voltages are generated. A reference voltage is generated and a logic state of each memory cell is determined based on the reference voltage and the respective generated cell voltage. The reference voltage is modified until a count of memory cells determined to be in a predefined logic state with respect to the last modified reference voltage value meets a criterium. In some embodiments the criterium may be an exact match between the memory cells count and an expected number of memory cells in the predefined logic state. In other embodiments, an error correction (ECC) algorithm may be applied while the difference between the count of cells in the predefined logic state and the expected number of cells in that state does not exceed a detection or correction power of the ECC.

Embodiments provide for predicting rowhammer attack vulnerability of one or more memory cells of a direct random access memory (DRAM) chip, the DRAM chip including a plurality of memory cells. An example method, determines, for each memory cell of a subset of memory cells of the plurality of memory cells, a leakage time t, a resistance of intrinsic leakage R.sub.L based at least in part on the leakage time t, an activation time of an adjacent aggressor row to flip a bit in the memory cell, a resistance of coupling leaking R.sub.SW based at least in part on the activation time, and a toggling count. The method identifies, based at least in part on one or more of the R.sub.SW, R.sub.L, or toggling count, whether the direct random memory access (DRAM) chip is vulnerable to a rowhammer attack.

A method, apparatus and system. The method includes: storing, in a memory circuitry, information on memory commands and associated addresses, the memory commands including read and write commands corresponding to associated addresses within memory chips of a storage device; in response to a determination of a read failure corresponding to at least one of the memory commands: performing a read operation on the information from the memory circuitry; and causing the information to be sent to a host of a computer system that includes the storage device, the information adapted to be used to implement a memory debugging operation for the memory chips.

Methods, systems, and devices for error control for memory device are described. A memory device may be configured to perform memory management operations including error control operations. For example, a memory device may be configured to perform an error control operation on data stored in a first memory cell coupled with a source row of a memory array. The memory device may be configured to write the data to a second memory cell coupled with the target row of the memory array based on performing the error control operation on the data and determine whether the management operation is complete based at least in part on the first column address of the first memory cell. The memory device may also generate an output signal to perform the error control operation on a third memory cell coupled with the source row based on determining whether the management operation is complete.

Methods, systems, and devices for error control for memory device are described. A memory device may be configured to perform memory management operations including error control operations. For example, a memory device may be configured to perform an error control operation on data stored in a first memory cell coupled with a source row of a memory array. The memory device may be configured to write the data to a second memory cell coupled with the target row of the memory array based on performing the error control operation on the data and determine whether the management operation is complete based at least in part on the first column address of the first memory cell. The memory device may also generate an output signal to perform the error control operation on a third memory cell coupled with the source row based on determining whether the management operation is complete.

A circuit includes a dynamic core data register (DCDR) cell that includes a data register, a shift register and an output circuit to route the output state of the data register or the shift register to an output of the DCDR in response to an output control input. A clock gate having a gate control input controls clocking of the shift register in response to a first scan enable signal. An output control gate controls the output control input of the output circuit and controls which outputs from the data register or the shift register are transferred to the output of the output circuit in response to a second scan enable signal. The first scan enable signal and the second scan enable signal to enable a state transition of the shift register at the output of the DCDR.