According to a certain embodiment, the semiconductor integrated circuit includes a plurality of memories and a first control circuit configured to control the plurality of memories. The first control circuit includes a first state transition circuit configured to execute at least one of write control and read control during an operation of the plurality of memories; and a second state transition circuit connected to the first state transition circuit, the second state transition circuit capable of causing the first state transition circuit to sequentially execute tests of the plurality of memories.

In an embodiment, a method includes: receiving, with a first buffer of a first error compactor unit (ECU), a first error packet associated with a first circuit; receiving, with the first buffer, a second error packet associated with a second circuit; transmitting a first reading request for reading the first error packet; receiving the first reading request with an arbiter of an error aggregator unit (EAU) of a central error management circuit; in response to receiving the first reading request, reading the first error packet from the first buffer, transmitting the first error packet to a controller of the central error management circuit, and transmitting a first acknowledgement to the first ECU; receiving the first acknowledgement with the first ECU; and in response to receiving the first acknowledgement, transmitting a second reading request for reading the second error packet.

During system initialization, each data buffer device and/or memory device on a memory module is configured with a unique (at least to the module) device identification number. In order to access a single device (rather than multiple buffers and/or memory devices), a target identification number is written to all of the devices using a command bus connected to all of the data buffer devices or memory devices, respectively. The devices whose respective device identification numbers do not match the target identification number are configured to ignore future command bus transactions (at least until the debug mode is turned off.) The selected device that is configured with a device identification number matching the target identification number is configured to respond to command bus transactions.

During system initialization, each data buffer device and/or memory device on a memory module is configured with a unique (at least to the module) device identification number. In order to access a single device (rather than multiple buffers and/or memory devices), a target identification number is written to all of the devices using a command bus connected to all of the data buffer devices or memory devices, respectively. The devices whose respective device identification numbers do not match the target identification number are configured to ignore future command bus transactions (at least until the debug mode is turned off.) The selected device that is configured with a device identification number matching the target identification number is configured to respond to command bus transactions.

A memory device includes a plurality of pins, a controller die coupled to the isolation pin, and a memory die. The plurality of pins include an isolation pin, a test mode select pin configured to switch an operation mode of the memory die, a test clock pin configured to receive a test clock, and a test data pin configured to perform a data transmission. The controller die is coupled to the isolation pin. The memory die is coupled to the test mode select pin, the test clock pin, and the test data pin.

Methods, devices, and systems for testing a number of combinations of memory in a computer system. A modular memory device is installed in a memory channel in communication with a processor. The modular memory device includes a number of memory storage devices. The number of memory storage devices include a number of pins. A subset of the number of memory storage devices is selected. A subset of the plurality of pins which do not correspond to the subset of the number of memory storage devices and are not part of a memory map of the computer system is selected. Each pin of the subset of the plurality of pins configured with a termination impedance. The subset of the number of memory storage devices is tested.

An imaging device includes a first memory configured to perform writing to multiple addresses thereof by designating the multiple addresses on address-by-address basis, a second memory configured to perform writing simultaneously to multiple address thereof, and a control circuit that controls readout of signals from the first memory and the second memory. The control circuit is configured to perform a first operation mode to sequentially designate the multiple addresses of the first memory and sequentially perform readout of signals from the multiple addresses of the first memory, and a second operation mode to sequentially designate the multiple addresses of the second memory and sequentially perform readout of signals from the multiple addresses of the second memory so that an output value from the second memory becomes the same as a value expected as an output value from the first memory in the first operation mode.

A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

In an embodiment, a method includes: receiving, with a first buffer of a first error compactor unit (ECU), a first memory error packet associated with a first memory; receiving, with the first buffer, a second memory error packet associated with a second memory; transmitting a first reading request for reading the first memory error packet; receiving the first reading request with an arbiter of an error aggregator unit (EAU) of a central memory error management unit (MEMU); in response to receiving the first reading request, reading the first memory error packet from the first buffer, transmitting the first memory error packet to a controller of the central MEMU, and transmitting a first acknowledgement to the first ECU; receiving the first acknowledgement with the first ECU; and in response to receiving the first acknowledgement, transmitting a second reading request for reading the second memory error packet.

Disclosed is a memory device including an error logic unit suitable for determining whether an error is present in command signals to generate a command error signal; a replica delay circuit suitable for replicating a delay value of the error logic unit and generating an input strobe signal by delaying a strobe signal of the command signals; an output strobe signal generation circuit suitable for generating an output strobe signal activated after a command error latency elapses from a time point at which the command signals are received; and a pipe circuit suitable for receiving and storing the command error signal in response to the input strobe signal and outputting the stored command error signal in response to the output strobe signal.