Methods, systems, and devices for imprint recovery for memory cells are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Technologies for performing a quick reliability scan include, for a particular block of a set of blocks of different block types. Each block of the set of blocks includes pages of memory of a physical memory device. A subset of the pages of the block is identified. The block is scanned by scanning the subset of the plurality of pages of the block for a fold condition. A page of the subset of the plurality of pages is determined to have the fold condition. After the set of blocks has been scanned, the folding of the block that includes the page that has been determined to have the fold condition is requested.

Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. A size of a subsequent set of read operations is set to a second number, which less than the first number, based on the indicator of data integrity.

Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.

Memories, and their operation, might include a plurality of content addressable memory (CAM) cells each for storing a respective data value, a match signal generator configured to generate an indication whether each CAM cell of the plurality of CAM cells indicates a match between its respective data value and a respective received signal value, and a plurality of storage elements each for storing a respective data value, wherein each storage element of the plurality of storage elements corresponds to a respective CAM cell of the plurality of CAM cells in a one-to-one relationship, and wherein each storage element of the plurality of storage elements is responsive to the indication of the match signal generator to generate a data signal indicative of the respective data value of that storage element if a match of their corresponding CAM cells is indicated.

A semiconductor apparatus may include a fuse cell array, an address generation circuit, a control circuit, and a command generation circuit. The fuse cell array may store a fail address. The address generation circuit may generate a copy address according to test information containing the fail address. The control circuit may control a repair operation including enabling a copy start signal according to the test information and storing the fail address in the fuse cell array according to a copy done signal. The command io generation circuit may generate an address and a plurality of commands for a data copy operation according to the copy start signal and enable the copy done signal when the data copy operation is completed.

The present disclosure includes systems, apparatuses, and methods for improving safety and correctness of data reading in flash memory devices associated with System-on-Chips. An example may include a plurality of sub-arrays, a plurality of memory blocks in each sub-array of the plurality of sub-arrays, a plurality of memory rows in each memory block of the plurality of memory blocks, and a plurality of extended pages in each memory row of the plurality of memory rows, wherein each extended page of the plurality of extended pages includes a group of data, an address, and an error correction code (ECC).

Methods, apparatus, systems and articles of manufacture are disclosed facilitate read-modify-write support in a coherent victim cache with parallel data paths. An example apparatus includes a random-access memory configured to be coupled to a central processing unit via a first interface and a second interface, the random-access memory configured to obtain a read request indicating a first address to read via a snoop interface, an address encoder coupled to the random-access memory, the address encoder to, when the random-access memory indicates a hit of the read request, generate a second address corresponding to a victim cache based on the first address, and a multiplexer coupled to the victim cache to transmit a response including data obtained from the second address of the victim cache.

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes: line type bits configured to store an indication that a corresponding cache line of the second sub-cache is configured to store write-miss data, and an eviction controller configured to evict a cache line of the second sub-cache storing write-miss data based on an indication that the cache line has been fully written.

A repair circuit includes: a plurality of redundant memory cells, each redundant memory cell being configured with a state signal; and a repair module connected to the plurality of redundant memory cells and configured to determine target memory cells from the redundant memory cells based on the state signals and repair defective memory cells through the target memory cells. The target memory cells are in one-to-one correspondence to the defective memory cells. The repair module can repair, at each of multiple repair stages, different defective memory cells, the plurality of redundant memory cells being shared at the multiple repair stages.