Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of backside reflections on measurement results. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of wavelengths are detected with high signal to noise ratio by a single detector.

Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures at ultraviolet, visible, and infrared wavelengths are presented herein. In another aspect, wavelength errors are reduced by orienting the direction of wavelength dispersion on the detector surface perpendicular to the projection of the plane of incidence onto the detector surface. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of infrared wavelengths are detected with high signal to noise ratio by a single detector. These features enable high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

A method of inspecting a silicon article includes irradiating a silicon article with infrared radiation, transmitting a portion of the infrared radiation through the silicon article, and filtering the infrared radiation transmitted through the silicon article. Image data is acquired from the filtered infrared radiation and an image of the silicon article reconstructed from the image data. Based on the reconstructed image of the silicon article, one or more anomalies defined within the silicon article are identified.

A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion.

A heat treatment apparatus is provided, which includes: a reaction chamber defined by an upper cover plate, a lower cover plate and a reaction chamber body; an infrared emitter located at an end of the upper cover plate; an infrared reflection sensor located at another end of the upper cover plate, and an infrared transmission sensor located at another end of the lower cover plate. The infrared emitter and the infrared reflection sensor are located at a side of the upper cover plate facing to the reaction chamber, the infrared transmission sensor is located at a side of the lower cover plate facing to the reaction chamber, the infrared emitter is located on a sidewall of an end of the reaction chamber body, and the infrared reflection sensor and the infrared transmission sensor are located on a sidewall of another end of the reaction chamber body.

A measurement method includes: a first measurement step of irradiating a prism with infrared light and measuring reflected light totally reflected by the prism; a second measurement step of irradiating the prism with infrared light while the prism is arranged on a substrate and measuring reflected light totally reflected by a surface of the prism on the substrate; and a calculation step of calculating an absorbance spectrum from an intensity spectrum of infrared light for each wave number of the reflected light measured in the first measurement step and an intensity spectrum of infrared light for each wave number of the reflected light measured in the second measurement step.

An optical filter including at least one of a high refractive index material and a low refractive index material; wherein the optical filter exhibits a reduced angle shift in at least one of a visible, near infrared, and an extreme ultraviolet wavelength is disclosed. A method of depositing a film is also disclosed.

Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures at ultraviolet, visible, and infrared wavelengths are presented herein. In another aspect, wavelength errors are reduced by orienting the direction of wavelength dispersion on the detector surface perpendicular to the projection of the plane of incidence onto the detector surface. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of infrared wavelengths are detected with high signal to noise ratio by a single detector. These features enable high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

In an embodiment, a method comprises fitting a spectroscopic data of a layer in a layered structure to a dielectric function having a real part and an imaginary part; confirming that the dielectric function is physically possible; based on the dielectric function not being physically possible, repeating the fitting the spectroscopic data, or, based on the dielectric function being physically possible, defining an n degree polynomial to the dielectric function; determining a second derivative and a third derivative of the n degree polynomial; equating the second derivative to a first governing equation and the third derivative to a second governing equation and determining a constant of the first governing equation and the second governing equation; and based on the key governing equations, determining one or more of a band gap, a thickness, and a concentration of the layer.

A method includes performing Chemical Mechanical Polish (CMP) on a wafer, placing the wafer on a chuck, performing a post-CMP cleaning on the wafer, and determining cleanness of the wafer when the wafer is located on the chuck.