An inspection management system having a plurality of processes and managing final inspection performed to inspect a completed product and one or more intermediate inspections performed to inspect an intermediate product manufactured in the processes earlier than a final process includes: an inspection content data acquisition unit that acquires inspection content data including an inspection standard for each inspection item of the product; an inspection content setting unit that sets inspection content based on the inspection content data acquired by the inspection content data acquisition unit; a simulation unit that simulates inspection in accordance with assumed inspection content; an inspection standard calculation unit that calculates an inspection standard more appropriate than a current inspection standard based on the simulation; and an output unit that outputs base information indicating that at least the inspection standard calculated by the inspection standard calculation unit is more appropriate than the current inspection standard.

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

An illumination device configured to illuminate an imaging target, an image of which is to be captured by a camera, provided with a current adjusting device configured to adjust a current flowing through the LEDs of four LED-mounted boards on which many of the LEDs are mounted, wherein the four LED-mounted boards are arranged in a four-sided shape centered around the light axis of the camera as viewed from the imaging target, and each of the LED-mounted boards is inclined at a specified angle so that the LEDs of the LED-mounted boards face the imaging target. The current adjusting device is configured to divide an LED-mounted area of each of the LED-mounted boards into multiple illumination areas and to individually adjust the current flowing to the LEDs of each of the LED-mounted boards for each of the multiple illumination areas.

An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.

A training device and a training method for a neural network model are provided. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.

A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

The present disclosure proposes an inspection apparatus. The inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.

A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.

A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.