A quality determination device is applied to a component mounter including a pallet and a suction nozzle, and includes a first determination section. The pallet includes supply units on which a solder ball group to be supplied to a target region, that is at least a part of a mounting area of a component to be mounted on a board is mounted. The solder ball group being disposed in accordance with electrode positions of the component. The suction nozzle picks up and holds a target object that is a supply unit or a solder ball group mounted on the supply unit, and supplies the target object to the target region of a board. The first determination section determines quality of the solder ball group mounted on at least one supply unit among the multiple supply units arranged in the pallet before the suction nozzle picks up the target object.

Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image.

An inspection management system having a plurality of processes and managing final inspection performed to inspect a completed product and one or more intermediate inspections performed to inspect an intermediate product manufactured in the processes earlier than a final process includes: an inspection content data acquisition unit that acquires inspection content data including an inspection standard for each inspection item of the product; an inspection content setting unit that sets inspection content based on the inspection content data acquired by the inspection content data acquisition unit; a simulation unit that simulates inspection in accordance with assumed inspection content; an inspection standard calculation unit that calculates an inspection standard more appropriate than a current inspection standard based on the simulation; and an output unit that outputs base information indicating that at least the inspection standard calculated by the inspection standard calculation unit is more appropriate than the current inspection standard.

A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.

A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.

A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.

Component mounter includes a transfer inspection device that inspects the transfer state of solder by imaging the bottom surface of a component, and a transfer inspection data creation device that creates transfer inspection data. The transfer inspection data creation device performs imaging of the bottom surface of a pre-transfer component with a camera at multiple shutter speeds, acquires the multiple pre-transfer images of different shutter speeds, obtains pre-transfer bump portion pixel values, performs imaging of the bottom surface of a post-transfer component with the camera at the same multiple shutter speeds, acquires the multiple post-transfer images of different shutter speeds, obtains post-transfer bump portion pixel values, and determines the shutter speed to be used when performing transfer inspection based on the post-transfer bump portion pixel values. Transfer inspection data is created based on the pre- and post-transfer bump portion pixel values of images captured at the determined shutter speed.

A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information. Therefore, the accuracy and reliability of the inspection can be improved.

A three-dimensional measurement device includes a light source and grid that irradiate a measurement object; a luminance controller that changes luminance levels of the light; a phase controller that changes phase levels of the light pattern; a camera that takes an image of the measurement object; and a processor that three-dimensionally measures a first measurement object area based on different image data taken by radiating a first light pattern in different phases; determines a relationship between a gain and offset determined according to an imaging condition based on the different image data; and three-dimensionally measures a second measurement object area based on two different image data taken by radiating a second light pattern in two different phases by using a gain and offset regarding each pixel determined according to a luminance value of each pixel in the two different image data and the determined relationship.