An accelerometer includes a base, two elastic portions and two masses. The base includes a supporting portion. Each of the elastic portions is connected to the supporting portion. The supporting portion is located between the two masses, the two masses are connected to the two elastic portions respectively, and the base supports the two elastic portions and the two masses merely by the supporting portion. The two masses are adapted to produce movements to enable the two elastic portions to be elastically deformed.

The present invention relates to microelectromechanical systems (MEMS), and more specifically to an anchor structure for anchoring MEMS components within a MEMS device. The anchor points for rotor and stator components of the device are arranged such that the anchor points are arranged along and overlap a common axis.

A vibration rectification error correction device includes a reference signal generation circuit that outputs a reference signal, a first frequency delta-sigma modulation circuit that performs frequency delta-sigma modulation on the reference signal by using a first measured signal to generate a first frequency delta-sigma modulated signal, a first filter, a second filter that operates in synchronization with the reference signal, and a first timing control circuit that controls a timing of outputting an input signal in synchronization with the first timing signal, in which the first filter and the first timing control circuit are provided on a signal path from an output of the first frequency delta-sigma modulation circuit to an input of the second filter.

An example system comprising: a microelectromechanical system (MEMS) vibrating beam accelerometer (VBA) comprising: a proof mass; and a first resonator mechanically coupled to the proof mass; a first electrode configured to apply a force to the proof mass.

According to some aspects of the subject technology, an apparatus includes an accelerometer including one or more sense electrodes to sense an input acceleration, and an unstick device to free the accelerometer from a stuck state due to a saturating acceleration input. The unstick device includes at least one unstick electrode and a control circuitry to cause the unstick electrode to generate vibrational energy to free the accelerometer.

Described herein are accelerometers, apparatus and systems incorporating accelerometers, and techniques for electrostatically adjusting a stiffness of a spring system in an accelerometer. Embodiments featuring resonant and/or quasi-static accelerometers are described. In certain embodiments, an accelerometer is a microelectromechanical systems (MEMS) device including a proof mass, an anchor, a spring attached to the proof mass, a sense electrode, and a tuning electrode. The spring and the proof mass form a spring system suspended from the anchor. The sense electrode is configured to generate a signal indicating movement of the proof mass based on application of a first signal. The tuning electrode is configured to receive an electrostatic tuning signal, the electrostatic tuning signal being separate from the first signal and providing a negative contribution to an overall stiffness of the spring system. The electrostatic tuning signal can be used to adjust the stiffness based on a measured acceleration.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines a central axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet, an upper base layer underlying the platform layer, and a lower base layer underlying the upper base layer. The outer ring overlies the upper base layer and is configured to couple to an outer radial portion of a proof mass assembly. The platform layer and lower base layer are made from high coefficient of thermal expansion (CTE) materials, while the upper base layer and outer ring are made from low CTE materials. Each relatively high CTE material has a higher CTE than each relatively low CTE material.

A proof mass assembly includes a monolithic substrate, the monolithic substrate including a proof mass, a proof mass support, and a flexure connecting the proof mass to the proof mass support. The proof mass is configured to rotate relative to the proof mass support via the flexure. The monolithic substrate further includes a first resonator connected to a first major surface of the proof mass and a first major surface of the proof mass support and a second resonator connected to a second major surface of the proof mass and a second major surface of the proof mass support.

An example proof mass assembly includes a proof mass; a proof mass support; a flexure connecting the proof mass to the proof mass support, wherein the proof mass is configured to rotate relative to the proof mass support via the flexure; a first resonator connected to a first major surface of the proof mass and a first major surface of the proof mass support; and a second resonator connected to a second major surface of the proof mass and a second major surface of the proof mass support, wherein at least one of the proof mass, the proof mass support, the flexure, the first resonator, or the second resonator is formed by selective laser etching.

A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.