G01P2015/0828

Vibrating beam accelerometer

A resonator defining a longitudinal axis that includes a mounting pad, a pad connector, at least one isolation mechanism, and a pair of elongated tines extending in the direction of the longitudinal axis. The isolation mechanism including an outer block defining a first outer end and a second outer end on opposite sides, an inner block defining a first inner end and a second inner end on opposite sides, and a pair of interconnect members, where each respective interconnect member of the pair of interconnect members connects the second outer end to the first inner end. The respective first ends of the pair of elongated tines being connected to the second inner end and the pad connector connects the mounting pad to the first outer end.

Microelectromechanical device for out-of-plane motion detection

The disclosure relates to a microelectromechanical device where the device structure includes a rotating mass structure and a linear mass structure. The rotating mass structure is formed of two rotating mass parts elastically coupled to the support through one or more springs that enable rotary motion of each of the rotating mass parts about respective rotary axes that extend parallel to each other along a first in-plane direction (IP1). The linear mass structure includes at least one elongate rigid body that extends in a second in-plane direction (IP2). One end of the linear mass structure is coupled to the first rotating mass part and the other end of the linear mass structure is coupled to the second rotating mass part such that rotary motions of the first and second masses result into linear motion of the linear mass structure in the out-of-plane direction (OP).

Inertial sensor with suspension spring structure surrounding anchor
11029327 · 2021-06-08 · ·

An inertial sensor includes a substrate, a movable element having an edge, and a suspension system retaining the movable element in spaced apart relationship above a surface of the substrate. The suspension system includes an anchor attached to the surface of the substrate, the anchor having a first side laterally spaced apart from the edge of the movable element, and a spring structure having a first attach point coupled to the first side of the anchor and a second attach point coupled to the edge of the movable element. The spring structure includes beam sections serially adjoining one another, the beam sections extending from the first side of the anchor and surrounding the anchor to couple to the edge of the movable element. The spring structure makes no more than one coil around the anchor to position the first attach point in proximity to the second attach point.

EFFECTIVE ACCELEROMETER HAVING A REDUCED SIZE

Microelectromechanical accelerometer comprising a support (2) and a mobile portion (4) able to be vibrated, means for measuring (10) the amplitude of the vibration of said mobile portion (4) in at least one detection direction of the plane of the accelerometer. The accelerometer comprises at least one foot (6) anchored on the support (2) by a first end and fixed to the mobile portion (4) by a second end, and allowing the mobile portion (4) to vibrate at least along said at least one detection direction under the effect of an acceleration force.

Resonant sensor device

A resonant sensor device includes a base and a detection substrate. The detection substrate includes a movable portion configured to move in a first direction, a supporter includes one or more supporting portions which extend in a direction along an intersecting plane intersecting the first direction, an intermediate fixing portion which is connected to the movable portion via the supporter, a connection portion which connects a mounting portion fixed to the base to the intermediate fixing portion in a second direction that is one direction along the intersecting plane, and a resonator at least partially embedded in the one or more supporting portions. The maximum dimension of the connection portion in a third direction orthogonal to the second direction in the intersecting plane is smaller than a maximum dimension of the supporter in the third direction.

Physical quantity sensor, electronic apparatus, and vehicle
10866260 · 2020-12-15 · ·

A physical quantity sensor includes an acceleration sensor having an acceleration sensor element and a package accommodating the acceleration sensor element, a support member having a first surface and supporting the acceleration sensor on the first surface, and an IC chip to which a second surface facing the first surface of the support member is attached, in which, in a plan view from a stacking direction of the acceleration sensor and the support member, in a case where an area of a region surrounded by an outer edge of the package is S1 and an area of the first surface is S2, S1S2 is satisfied.

MEMS pendulum accelerometer having two measurement ranges

An accelerometer sensor having electrodes forming capacitors of capacitance that vary as a function of distances between the electrodes, a control unit being arranged to perform an operation of measuring the capacitances and a control operation that comprises selectively: a fine control stage in which a first voltage is applied between one of the stationary electrodes and the movable electrode, while the other stationary electrode is at the same potential as the movable electrode; and an extended control stage in which a second voltage is applied between one of the stationary electrodes and the movable electrode, the other stationary electrode being at the same potential as the movable electrode, and the second voltage being greater in absolute value than the first voltage. A method using such a sensor.

Reducing thermal expansion induced errors in a magnetic circuit assembly

A magnetic circuit assembly for an accelerometer includes an excitation ring that includes a base portion defining oppositely facing first and second sides, a ring portion extending from the second side of the base portion to define a ring recess, a first metallic inlay recessed into the first side of the base portion in which the first metallic inlay includes a material different than that of the base portion, a second metallic inlay recessed into the second side of the base portion in which the second metallic inlay includes a material different than that of the base portion, and a magnet received within the ring recess and attached to the second metallic inlay.

Micromechanical component for a pressure sensor device
10845262 · 2020-11-24 · ·

A micromechanical component for a pressure sensor device, including a diaphragm, which separates a reference pressure from an external pressure, at least one first stator electrode, at least one second stator electrode, and a rocker-arm structure, which is tiltable about an axis of rotation and has at least one first actuator electrode and at least one second actuator electrode; the rocker-arm structure being joined to the diaphragm so that when the external pressure and the reference pressure are equal, the rocker-arm structure and its actuator electrodes are present in their starting positions; if the rocker-arm structure and its actuator electrodes are in their starting positions, a first capacitance between the at least one first actuator electrode and the at least one first stator electrode differing from a second capacitance between the at least one second actuator electrode and the at least one second stator electrode.

COMPOSITE SENSOR AND MANUFACTURING METHOD THEREOF
20200319228 · 2020-10-08 ·

The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.