The present invention relates to a low-thermal resistance pressing device for a socket, which mainly comprises a housing, an inner collar, a heat conductive pressing block, a bearing collar and a locking member. The locking member on the housing is used to lock the socket. The inner collar is threadedly engaged with the housing. The bearing collar is located between the inner collar and the heat conductive pressing block. In the case of rotating the inner collar in the housing, the bearing collar drives the heat conductive pressing block to move axially so as to exert an axial force to a device to be tested. Because the heat conductive pressing block protrudes from the upper and lower surfaces of the housing, one end thereof can be in contact with a temperature control module, and the other end thereof can be in contact with the device to be tested.

A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.

Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.

A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

An electronic component testing apparatus that tests a DUT (device under test) disposed in a carrier includes: a test head including a socket; and an electronic component handling apparatus that presses the DUT in the carrier against the socket. The socket includes: contactors disposed to correspond to terminals of the DUT that are exposed to the socket via a first opening of the carrier; and a first wall projecting toward the carrier along a pressing direction of the DUT. The electronic component handling apparatus aligns the terminals with the contactors by pressing the DUT against the socket such that a first pressing mechanism of the carrier presses the DUT against the first wall.