A probe head for a test equipment of electronic devices comprises a plurality of contact probes inserted in guide holes provided in at least one upper guide and one lower guide, a bending area for the contact probes being defined between the upper and lower guides, each contact probe having at least one first terminal portion which protrudes of a first length from the lower guide and ends with a contact tip (22A) adapted to abut onto a respective contact pad of a device to be tested, as well as a second terminal portion which protrudes of a second length from the upper guide and ends with a contact head adapted to abut onto a contact pad of a board for connecting or interfacing with the test equipment, suitably comprising at least one protection structure projecting from the upper guide in direction of a longitudinal development axis of the contact probes towards the board, the protection structure thus extending in correspondence of the contact heads of the contact probes.

[Problem] In order to improve conductivity, the number of components is decreased, and a sliding property of an elastic member can be improved. Elastic force can be controlled in accordance with a characteristic of a contact object, and electrical contact stability with the contact object can be improved.

[Solution] An electrical contactor of the present disclosure is formed by winding a plate member having conductivity. The electrical contactor includes a first contact part that is formed by winding a first tip part of the plate member, a first elastic part that is formed by winding an upper arm part having a tapered shape, a second contact part that is formed by winding a second tip part, a second elastic part that is formed by winding a lower arm part having a tapered shape, and a cylindrical part that is formed by winding a main body part that is a plate member.

A probe pin having an improved gripping structure is disclosed. The disclosed probe pin includes a pin body including a plurality of holes and positioned at one side, a first extension portion extending upward from an outer side of the pin body, a second extension portion elongated from the other end of the first extension portion, further extending than the pin body in the other direction, and spaced apart from the pin body, and a tip part integrated with the second extension portion and having an end sharply protruding upward from an outer upper end of the second extension portion, in which the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part.

When a probe is made thin so as to correspond to the electrode pitch of a semiconductor device, the mechanical strength becomes insufficient. Efforts are required to devise a thin metal plate with sufficient mechanical strength. On the surface of a probe of probe card use, there are provided with a plurality of deformation regions of hollow shape or protrusion shape and a framework region provided on the boundary between adjacent deformation regions. The stress at the deformation regions is made to be distributed.

A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe includes a head; a body containing at least one resilient element; and a bottom. The body has a cylindrical shape, and the head and the body have a same diameter in an end view. The head includes a base and a top integrated with the base. The base has a cylindrical shape. The head includes a shoulder between the base and the top. The top includes an apex. The force spring probe and the sense spring probe are disposed so that the apexes of the force spring probe and the sense spring probe are adjacent to each other.

Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

A contact probe includes: a first plunger; a second plunger; and a coil spring provided between the first and second plungers and configured to connect the first and second plungers to each other so as to freely advance and retreat. The first plunger is provided with a groove portion formed on a side surface of the first plunger.

A contact probe for a testing head for testing electronic devices includes a rod-like body made of a first conductive material and extending along a longitudinal axis, and a contact tip supported by the body at an end portion thereof. The contact tip is made of a second conductive material that is different from the first conductive material. The contact tip includes a contact zone configured to perform mechanical and electrical contact with contact pads of a device under test. The body and the contact tip include respective contact surfaces in contact with each other. The contact surfaces are complementary to each other and include respective connection elements engaging each other. The connection elements include a protruding element projecting from the contact surface of one among the body and the contact tip, and a recess made in the other among the body and the contact tip.

A probe pin includes a coil spring extending and contracting along a center line, a first contact disposed on one side of the center line and having a rectangular cross section, and a second contact disposed on the other side of the center line and having a rectangular cross section. The first contact and the second contact are supported so as to be reciprocable via the spring coil and are electrically connected to each other. In particular, a contact surface of at least one of the first contact and the second contact is an inclined surface inclined so as to descend along a thickness direction.

A method of securing a probe tip to a device under test (DUT), the method comprising: positioning the probe tip near a test point of the DUT, the probe tip comprising a connection point on a signal-path portion of the probe tip and an attachment tab, the connection point making an electrical connection with the test point of the DUT, the attachment tab extending away from the signal-path portion of the probe tip; applying an adhesive to the DUT through a hole in the attachment tab of the probe tip; and curing the adhesive to secure the probe tip to the DUT.