A probe card device and a self-aligned probe are provided. The self-aligned probe includes a fixing end portion configured to be abutted against a space transformer, a testing end portion configured to detachably abut against a device under test (DUT), a first connection portion connected to the fixing end portion, a second connection portion connected to the testing end portion, and an arced portion that connects the first connection portion and the second connection portion. The fixing end portion and the testing end portion jointly define a reference line passing there-through. The first connection portion has an aligned protrusion, and a maximum distance between the arced portion and the reference line is greater than 75 μm and is less than 150 μm.

A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.

A probe card includes a sub-board, having a heating layer, connected to a probe pin. A main board is connected to the sub-board and includes a first output terminal configured to output first power received from a first power supply to the heating layer in a first mode. A power converter is configured to lower a first voltage corresponding to residual power received from the first power supply to a second voltage and output the residual power in a second mode. A second output terminal is configured to receive the residual power from the power converter and second power from a second power supply and output third power including the residual power and the second power to a device under test in the second mode. A first switch unit is connected to the first power supply, the first output terminal, and the power converter.

A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

The present disclosure provides a probe and a probe card device. The probe card device includes a first plate and a plurality of probes. The probes are arranged through the first plate, and include a first probe and a second probe. The first probe has a first body and an end portion of the first body. The end portion of the first body has a first recess and a first protrusion. The second probe has a second body and an end portion of the second body. The end portion of the second body has a second recess and a second protrusion. The second protrusion extends into the first recess.

A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.