A probe card includes: a plurality of conductive contact probes; a probe head configured to accommodate ends of the plurality of contact probes; a laminated member laminated on the probe head on a side opposite to a side of the probe head; and a fastening member including a screw and a nut configured to fasten the probe head and the laminated member to each other, the screw including a head provided on the side of the probe head in which the contact probes extend outwardly, and a shaft inserted through the probe head and the laminated member, the shaft extending and having a diameter smaller than a diameter of the head. The shaft is fixed to the probe head, is threadedly connected to the nut on an end side opposite to the head side, and is configured to fasten the probe head and the laminated member to each other.

Provided is an inspection socket capable of elastically contacting the conductor with the electrode of the object to be tested and the electrode for inspection by pushing the object to be inspected toward the inspection substrate side, without adhering foreign matters or contact marks to the object to be inspected. The inspection socket is so configured that the object to be inspected (100) is pushed toward the inspection substrate (10) without touching the object to be inspected (100), by integrally holding the object to be inspected (100) and the positioning table (20) using air pressure (negative pressure or positive pressure) and pushing the positioning table (20) by the pushing unit (50), so that the object to be inspected comes into contact with the land (11) of the inspection substrate (10) through the contact probe (30).

The present disclosure describes a probe design to measure cycles of microdevices. In particular, the probe comprises, electrodes, dielectric, stimulating capacitor, voltage stimulating source for time varying stimulating voltage signal and a series switch to control biasing condition. The probe structure further has a probe tip and resting pads (ring shape or otherwise) along with a leveling mechanism and apparatus. The disclosure also describes a method to measure cycles of microdevices using the probe structure.

A burn-in board for testing the operational integrity of memory devices includes local heating elements for each memory device under test. Each socket on the burn-in board may include a pair of opposed latch heads which move between open positions allowing a memory device to be mounted in the socket, and closed positions where the latch heads rest against the memory device to secure the device in the socket. Local heating elements may be integrated into the latch heads to ensure even heating of each memory device in the burn-in board.

A probe unit includes: a plurality of first contact probes each coming into contact with an electrode to be contacted on one end side in a longitudinal direction; a second contact probe connected to an external ground; and a probe holder configured to hold the first and second contact probes, the probe holder including a first hollow portion configured to allow the first contact probes to be inserted therethrough and hold the first contact probes, a second hollow portion configured to allow the second contact probe to be inserted therethrough and hold the second contact probe, and a through-hole provided around the first hollow portion, wherein the probe holder includes a conductive portion that constitutes the through-hole and electrically connects the through-hole and the second contact probe.

A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.

A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A contactor assembly for a testing system for testing integrated circuit devices includes a contact, and a housing having a contact slot. The contact is receivable in the contact slot. The contact includes a tip, a body, and a tail; and is configured to be in a free state, a preload state, and an actuated state. The housing includes a housing backstop. When the contact is in the preload state, a contact backstop of the contact is biased against the housing backstop.

A reconfigurable load board clamp is disclosed. The reconfigurable load board clamp includes first and second slotted ends; first and second opposing sides laterally coupled to the first and second slotted ends; and a MCPCB pin board removably coupled to the first and second slotted ends. The pin board includes a card edge connector plugged into an end of the pin board and multiple spring-loaded pin connectors. In implementations, multiple pin boards may be removed and added to the reconfigurable load board clamp to form a pin array suitable for a particular load board.