A semiconductor fabricating apparatus may include a probe card, a test head, a support and a chamber wall. The probe card may include a plurality of probing needles. The probe card may be installed at the test head. The support may be configured to receive a wafer including a plurality of test pads making contact with the probing needles. The chamber wall may be configured to receive the support. The chamber wall may define a chamber in which a probe test may be performed. At least one of the probe card and the support, the probe card and the test head, and the test head and the chamber wall may be combined with each other by a magnetic module.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

A high bandwidth differential test probe for measuring a device under test is provided. The test probe comprises a first probe tip arranged at a first coaxial connector relative to a first rotational axis, and a second probe tip arranged at a second coaxial connector relative to a second rotational axis. For adjusting the distance between the first probe tip and the second probe tip, the first coaxial connector is rotatable with respect to the first rotational axis and the second coaxial connector is rotatable with respect to the second rotational axis. Additionally, a tilt angle between the first probe tip and a plane comprising both the first and second rotational axes, and a tilt angle between the second probe tip and the plane, is not equal to zero.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

A vertical probe card and a fence-like probe thereof are provided. The fence-like probe has a probe length within a range from 5 mm to 8 mm. The fence-like probe includes a fence-like segment, a ceramic layer, a connection segment, and a testing segment. The fence-like segment has an elongated shape defining a longitudinal direction, and the fence-like segment has a penetrating slot that is formed along the longitudinal direction and that has a length greater than 65% of the probe length. The ceramic layer is directly formed on an outer surface of the fence-like segment and covers two long walls of the penetrating slot. The connection segment and the testing segment are respectively connected to two end portions of the fence-like segment, and is not formed on the connection segment and the testing segment.

A vertical probe card having different probes is provided, and includes a first guiding board unit, a second guiding board unit, and a plurality of fence-like probes passing through the first and the second guiding board units. Each of the fence-like probes has a probe length within a range from 5 mm to 8 mm, and includes a fence-like segment, a connection segment, and a testing segment. The fence-like segment includes a penetrating slot having a length greater than 65% of the probe length. The fence-like segment includes two arms respectively arranged at two opposite sides of the penetrating slot and spaced apart from each other by an adjustment distance within a range from 10 μm to 120 μm. The fence-like probes include a first probe and a second probe, which have a same contact force and are configured to respectively meet different electrical transmission requirements.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

A test assembly for testing a device under test includes a probe card assembly and a cap secured to the probe card assembly. The probe card assembly includes a probe tile having a plurality of openings. The probe tile includes a plurality of probe wires including a probe needle portion and a probe tip portion. A seal is disposed on a surface of the probe tile and forms an outer perimeter of a pressurized area. The probe tile includes an insulation layer formed within the pressurized area that is configured to separate the probe needle portion from the device under test. The insulation layer includes an aperture through which the probe tip portion extends to contact the device under test. The cap includes a fluid inlet and a fluid return outlet that are in fluid communication with the plurality of openings of the probe tile.

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.

Disclosed is a test device for testing electric characteristics of an object to be tested. The test device comprises a test circuit board comprising an insulating base substrate formed with a printed circuit, a plurality of signal contact points connected to the printed circuit and applying a test signal to the object to be tested, and a substrate shielding portion formed in a thickness direction of the base substrate between the plurality of signal contact points; and a test socket comprising a plurality of signal pins to be in contact with the plurality of signal contact points, and a conductive block supporting the plurality of signal pins without contact. With this, a secure noise shield is made between lines for applying a test signal when a high-frequency and high-seed semiconductor is subjected to the test, thereby improving reliability of the test.