A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

A self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers are provided. A wafer carrier system includes, for instance, a housing configured for transport within the automated material handling system, the housing having a support configured to support a semiconductor wafer in the housing, and a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising a sensing unit and a computing unit operably connected to the sensing unit. Also provided are methods of measuring one or more characteristics of a semiconductor wafer within the wafer carrier systems of the present disclosure.

A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

A vision alignment system for a test handler system includes a transfer mechanism that transfers a device from an input side to a test side, a contactor array positioned at the test side, and a pick-and-place device that moves the device from the transfer mechanism to the contactor array. An engagement mechanism on the pick-and-place device engages with alignment devices on the transfer mechanism and contactor array. To avoid positioning the vision alignment system in the test side, a first vision mechanism is positioned away from the test socket and determines the position of the device in a common local coordinate system, a second vision mechanism is positioned at an output side and determines a position of the contactor array in the local coordinate system, and the correction mechanism corrects a position of the device based on an offset between the positions in the coordinate system.

A testing device for testing an electronic device includes a base, a testing mechanism, a pushing mechanism, and a fastening mechanism. The testing mechanism is rotatably fastened to the base and can be rotated from a first position to a second position. The fastening mechanism is mounted on the base. The pushing mechanism is rotatably mounted on the testing mechanism. When the testing mechanism is rotated from the first position to the second position, the pushing mechanism is rotated and pushes against the testing mechanism. The testing mechanism is connected to an electronic device. The testing mechanism is positioned in the second position via the fastening mechanism.

A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

A conveyance apparatus for electronic components capable of suppressing the adhesion of electronic components to a storing member by static electricity. The conveyance apparatus for electronic components includes: a storing member which includes cavities for storing electronic components respectively; an electronic component supply mechanism which supplies the electronic components in a state where the electronic components are brought into contact with the storing member; and a moving unit which moves the storing member in a predetermined moving direction in a relative relationship with the electronic component, wherein a recessed portion for reducing a contact area of the storing member with the electronic components is formed in a region where the cavities are not formed on a main surface of the storing member on a side where the electronic components are supplied.

A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

A test apparatus includes a tray including at least a first region and a second region, and a cap disposed over the tray. The cap includes a cap body, and at least a first magnet and a second magnet disposed over the cap body. The first magnet is configured to provide a first magnetic field to the first region of the tray, and the second magnet is configured to provide a second magnetic field to the second region of the tray. A strength of the first magnetic field is different from a strength of the second magnetic field.