Embodiments of the present disclosure relate to methods of finding optimized analog measurement hardware settings of a measurement system for a target measurement. The method can include one or more of the following steps: applying initial settings to the measurement system; varying the settings over a power sweep while processing a test signal used for the target measurement or a representative signal; performing the target measurement during the power sweep, thereby determining a hardware contribution of the measurement system over the power sweep; and identifying the respective settings that lead to a minimum hardware contribution of the measurement system at various powers.

A semiconductor device addresses to a problem in which a current consumption variation rate increases during BIST execution causing resonance noise generation in a power supply line. The semiconductor device includes a self-diagnosis control circuit, a scan target circuit including a combinational circuit and a scan flip-flop, and an electrically rewritable non-volatile memory. A scan chain is configured by coupling a plurality of the scan flip-flops. In accordance with parameters stored in the non-volatile memory, the self-diagnosis control circuit can change a length of at least one of a scan-in period, a scan-out period and a capture period, and can also change a scan start timing.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

Physical or off-chip interfaces may be selectively bypassed in a boundary scan chain. A bypass control signal may be produced that indicates whether to bypass a selected one of the interfaces. In response to a first state of a bypass control signal, a multiplexer may couple the scan chain output of an interface boundary scan cell to the scan chain input of a successor boundary scan cell of the interface boundary scan cell. In response to a second state of the bypass control signal, the multiplexer may couple the scan chain output of a predecessor boundary scan cell of the interface boundary scan cell to the scan chain input of the successor boundary scan cell, bypassing the interface boundary scan cell.

An integrated circuit (IC) includes subcircuits, power switches coupled to pass load current to a respective one of the subcircuits when activated by a respective switch control signal, and sensing circuits. Each of the sensing circuits is coupled to a respective one of the subcircuits, wherein the sensing circuits are configured to generate sense currents that are proportional to the respective load currents. The IC also includes a conversion circuit configured to receive at least one of the sense currents and to convert the at least one of the sense currents to an equivalent multi-bit digital signal, a timestamp circuit configured to generate a timestamp value that is correlated with the multi-bit digital signal, and a controller configured to provide signals to operate the power switches and the sensing circuits.

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

An augmented simulation model can be created of an integrated circuit (IC) design by inserting a switch in a simulation model of the IC design between an output of a scan cell and an input of a combinational logic cloud. A simulation enable signal can be used to control the switch. Next, an IC design simulation environment can be generated based on the augmented simulation model. The IC design can be verified by using the IC design simulation environment. The simulation enable signal can be activated when the combinational logic cloud is desired to be simulated by the IC design simulation environment.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.