G01R31/318583

Circuits And Methods For Configurable Scan Chains
20220187370 · 2022-06-16 · ·

An integrated circuit includes first and second data storage circuits, first, second, and third shadow storage circuits, and first, second, and third multiplexer circuits. The first multiplexer circuit is configurable to provide a state of a data signal from the first data storage circuit to the first shadow storage circuit in a snapshot mode. The second multiplexer circuit is coupled between an output of the second data storage circuit and an input of the second shadow storage circuit. The third multiplexer circuit is coupled to the second multiplexer circuit. The third multiplexer circuit is configurable to provide a state of an output signal of the first shadow storage circuit to an input of the third shadow storage circuit in a scan mode bypassing the second shadow storage circuit.

Multi-stage machine learning-based chain diagnosis

Various aspects of the disclosed technology relate to machine learning-based chain diagnosis. Faults are injected into scan chains in a circuit design. Simulations are performed on the fault-injected circuit design to determine observed failing bit patterns. Bit-reduction is performed on the observed failing bit patterns to construct first training samples. Using the first training samples, first-level machine-learning models are trained. Affine scan cell groups are identified. Second training samples are prepared for each of the affine scan cell groups by performing bit-filtering on a subset of the observed failing bit patterns associated with the faults being injected at scan cells in the each of the affine scan cell groups. Using the second training samples, second-level machine-learning models are trained. The first-level and second-level machine learning models can be applied in a multi-stage machine learning-based chain diagnosis process.

REFORMATTING SCAN PATTERNS IN PRESENCE OF HOLD TYPE PIPELINES

A method includes identifying state holding pipeline stages in a pipeline path of a design for test (DFT) of an integrated circuit design, splitting each pattern of a plurality of patterns into a first part and a second part, reformatting the plurality of patterns to generate another plurality of patterns such that the first part and the second part of each pattern of the plurality patterns are included in different patterns of the another plurality of patterns. The length of the first part is a function of a number of the identified pipeline stages.

CONTROLLING TEST NETWORKS OF CHIPS USING INTEGRATED PROCESSORS
20220138387 · 2022-05-05 ·

The disclosure provides using test processors to provide a more flexible solution compared to the existing DFX blocks that are used for controlling test networks in chips. The test processors provide a highly flexible solution since programming of the test processors can be changed at any time; even after manufacturing, and can support practically an unlimited number of core chips in any configuration. The high flexibility provided via the test processors can reduce engineering effort needed in design and verification, accelerate schedules, and may prevent additional tapeouts in case of DFX design bugs. By making debug and diagnosis easier by providing an opportunity to change debug behavior as needed, the time-to-market timeline can be accelerated. Accordingly, the disclosure provides a chip with a test processor, a multi-chip processing system with a test processor, and a method of designing a chip having a test processor.

Scan circuit and method

In an embodiment, a method for performing scan includes: entering scan mode; receiving a test pattern; applying the test pattern through a first scan chain by asserting and deasserting a scan enable signal to respectively perform shift and capture operations to the first scan chain; while applying the test pattern through the first scan chain, controlling a further scan flip-flop with the first scan chain without transitioning a further scan enable input of the further scan flip-flop; and evaluating an output of the first scan chain to detect faults.

Test method and test system
11320484 · 2022-05-03 · ·

The present invention provides a method, device, and system for testing devices under testing (DUTs). The method comprises: sending a scan activated signal and a synchronous clock signal via the second signal line, and sending a first preset signal via the serial signal line, wherein each bit of the first preset signal is transmitted to a corresponding scan chain unit in a sequence of serial connection of the plurality of scan chain units with according to the synchronous clock signal, the corresponding scan chain unit is one of the plurality of scan chain units connected serially and coupled to the plurality of DUTs via a third signal line; sending a scan deactivated signal via the second signal line, to deactivate the scan chain units from identifying and receiving the first preset signal; and sending a second preset signal via the second signal line, and sending a test signal via the first signal line.

Process for Scan Chain in a Memory
20230296672 · 2023-09-21 · ·

A scan chain architecture with lowered power consumption comprises a multiplexer selecting between a functional input and a test input. The output of the multiplexer is coupled to a low threshold voltage latch and, in test mode, to a standard threshold voltage latch. The low threshold voltage latch and standard threshold voltage latch are configured to store data when a clock input falls, using a master latch functional clock M_F_CLK, master latch test clock M_T_CLK, slave latch functional clock S_F_CLK, and slave latch test clock S_T_CLK. The slave latch has lower power consumption than the master latch.

Performing scan data transfer inside multi-die package with SERDES functionality

A system for performing a scan test of a processor core includes a scan test module and a processor including a processor core and an input/output die, where the input/output die is coupled to the processor core. The scan test module transmits, in parallel to the input/output die, scan test input data. A serializer/deserializer module of the input/output die receives the input data, serializes the input data, and transmits the serialized input data to the processor core. A serializer/deserializer module of the processor core receives the serialized scan test input data, deserializes the input data, receives result data generated in dependence upon the input data, serializes the result data, and transmits the serialized result data to the input/output die. The input/output die serializer/deserializer module receives the result data, deserializes the result data, and provides the result data to the scan test module. Error detection can be carried out through redundancy.

Performing scan data transfer inside multi-die package with SERDES functionality

A system for performing a scan test of a processor core includes a scan test module and a processor including a processor core and an input/output die, where the input/output die is coupled to the processor core. The scan test module transmits, in parallel to the input/output die, scan test input data. A serializer/deserializer module of the input/output die receives the input data, serializes the input data, and transmits the serialized input data to the processor core. A serializer/deserializer module of the processor core receives the serialized scan test input data, deserializes the input data, receives result data generated in dependence upon the input data, serializes the result data, and transmits the serialized result data to the input/output die. The input/output die serializer/deserializer module receives the result data, deserializes the result data, and provides the result data to the scan test module. Error detection can be carried out through redundancy.

Wafer scale testing using a 2 signal JTAG interface
11782091 · 2023-10-10 · ·

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.