G01R31/31932

Fault detection

A method for detecting a fault in a sensor arrangement is described. The method comprising modulating at least one physical parameter of the sensor arrangement by a configuration value, wherein the at least one physical parameter of the sensor arrangement is modulated during operation of the sensor arrangement, comparing an output of the sensor arrangement with a reference output related to the modulated at least one physical parameter and detecting a fault based on the comparison. Furthermore, also a corresponding processing circuit is described.

Semiconductor device, semiconductor system, and control method of semiconductor device

A semiconductor device, a semiconductor system, and a control method of a semiconductor device are capable of accurately monitoring the lowest operating voltage of a circuit to be monitored. According to one embodiment, a monitor unit of a semiconductor system includes a voltage monitor that is driven by a second power supply voltage different from a first power supply voltage supplied to an internal circuit that is a circuit to be monitored and monitors the first power supply voltage, and a delay monitor that is driven by the first power supply voltage and monitors the signal propagation period of time of a critical path in the internal circuit.

Test method for control chip and related device

Embodiments of the present disclosure provide a test method and apparatus for a control chip, and an electronic device, which relate to the field of semiconductor device test technologies. The control chip includes a built-in self-test BIST circuit. The method is performed by the BIST circuit. The method includes: reading first test vectors stored in a first target memory chip; sending the first test vectors to the control chip; receiving first output information returned by the control chip in response to the first test vectors; and acquiring a first test result of the control chip based on the first output information and the first test vectors corresponding to the first output information. By means of the technical solutions provided in the embodiments of the present disclosure, so that a storage space for test vectors can be enlarged, and the test efficiency can be increased.

Protocol analysis and visualization during simulation
10816600 · 2020-10-27 · ·

Protocol analysis can include simulating, using a processor, a circuit design including a protocol analyzer embedded therein. The protocol analyzer can be coupled to low-level signals of an interface of the circuit design. During the simulating, the protocol analyzer detects a transaction from the low-level signals received from the interface. Transaction data is generated by the protocol analyzer specifying the transaction. The transaction data is output from the protocol analyzer.

Automatic device detection and connection verification

Disclosed is a test and measurement instrument including a plurality of ports. The ports are configured to source a test signal into a device under test (DUT), and receive a signal response from the DUT. The test and measurement instrument also includes a measurement unit configured to measure the signal response. The test and measurement instrument further includes a processor configured to compare the signal response to a data structure. The processor also determines a classification of, and/or connections to, at least one DUT component coupled to at least one of the ports based on results of the comparison.

IC Device Authentication Using Energy Characterization
20200271719 · 2020-08-27 ·

Systems, methods, and apparatuses are described for verifying the authenticity of an integrated circuit device. An integrated test apparatus may use quiescent current and/or conducted electromagnetic interference readings to determine if a device under test matches the characteristics of an authenticated device. Deviations from the characteristics of the authenticated device may be indicative of a counterfeit device.

BUILT-IN SELF-TEST CIRCUITS AND RELATED METHODS
20200271722 · 2020-08-27 ·

Built-in self-test (BIST) circuits and related methods are disclosed. An example BIST circuit includes a state machine to generate a control signal to reduce a gate voltage associated with a transistor from a first voltage to a second voltage when an enable signal is asserted, the transistor to be enabled at the first voltage and the second voltage, and assert an alert signal when a gate-to-source voltage associated with the transistor satisfies a threshold when the gate voltage is reduced to the second voltage.

ADHESIVE COMPOSITION AND METHODS OF FORMING THE SAME

An adhesive may include an adhesive structure and an adhesive composition. The adhesive structure may include a graft copolymer. The adhesive composition may include at least about 1 wt. % and not greater than 40 wt. % of a macromonomer component for a total weight of the adhesive composition, at least about 50 wt. % and not greater than about 98 wt. % of a (meth)acrylic based polymeric component A for a total weight of the adhesive composition, and at least about 0.1 wt. % and not greater than about 30 wt. % of a tackifier component for a total weight of the adhesive composition. The macromonomer component may have a weight-average molecular weight of at least 1000 g/mol and a glass transition temperature (Tg) of at least about 40 C. The (meth)acrylic based polymeric component A may have a glass transition temperature (Tg) of not greater than about 20 C.

CLASSIFYING COMPARATORS BASED ON COMPARATOR OFFSETS
20200213139 · 2020-07-02 ·

Various embodiments relate to classifying comparators based on comparator offsets. A method may include applying, via a strobe, a first voltage to each of a first input and a second input of a comparator to generate a number of output signals from the comparator, wherein each output signal has one of a first polarity and a second polarity. The method may further include in response to each of the number of output signals being the first polarity, applying, via a strobe, an external offset voltage having the second polarity to the comparator to generate a second number of output signals. Further, the method may include in response to each of the second number of output signals being the same polarity, identifying the comparator as a reliable comparator.

IC device authentication using energy characterization
10684324 · 2020-06-16 · ·

Systems, methods, and apparatuses are described for verifying the authenticity of an integrated circuit device. An integrated test apparatus may use quiescent current and/or conducted electromagnetic interference readings to determine if a device under test matches the characteristics of an authenticated device. Deviations from the characteristics of the authenticated device may be indicative of a counterfeit device.