A fiber gripper component includes a fiber receiving recess which extends from a first surface of the fiber gripper component toward a second surface of the fiber gripper component. The fiber receiving recess extends from a front face to a rear face. The fiber receiving recess has a fiber receiving surface which is positioned between the first surface and the second surface. A plurality of resilient fiber receiving grooves extend from the fiber receiving surface toward the second surface. The resilient fiber receiving grooves have a width which is less than an outer-diameter dimension of mating optical fibers to provide a press fit of the optical fibers into the resilient fiber receiving grooves. The fiber gripper component is molded with tolerances in the submicron range to maintain part functionality to allow automatable fiber assembly.

A track system for routing an optical fiber includes a track for selectively retaining the optical fiber therein, a cover piece which is mounted to the track, and a corner piece which is mounted to the track. The track is formed as an elongated member and includes a pair of legs that are spaced apart from each other to define a slot and an internal channel into which the optical fiber is received. The cover piece is mountable to the track to help retain the optical fiber in the track.

An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.

The invention relates to a fiber clamp with a base plate and at least two clamping bodies arranged parallel to one another on the base plate, the clamping bodies being pressed towards one another in one direction by means of a tensioning device, so that a fiber that can be arranged between the base plate and the clamping bodies is between the base plate and the clamping bodies can be pinched.

An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.

Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.

Aspects and techniques of the present disclosure relate to an alignment device that includes a groove-type alignment structure with a support region for receiving an optical fiber inserted along a fiber insertion axis. The optical fiber has a first side and a second, opposite side. The groove-type alignment structure engages the first side of the optical fiber. The alignment device includes a stabilization structure that engages the first side of the optical fiber and a first angled transition surface that engages the second, opposite side of the optical fiber. The present disclosure also relates to an alignment system that includes a first housing piece; a second housing piece adapted to mate with the first housing piece; and a flat structure positioned between the first and second housing pieces.

Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.

Aspects and techniques of the present disclosure relate to an alignment device that includes a groove-type alignment structure with a support region for receiving an optical fiber inserted along a fiber insertion axis. The optical fiber has a first side and a second, opposite side. The groove-type alignment structure engages the first side of the optical fiber. The alignment device includes a stabilization structure that engages the first side of the optical fiber and a first angled transition surface that engages the second, opposite side of the optical fiber. The present disclosure also relates to an alignment system that includes a first housing piece; a second housing piece adapted to mate with the first housing piece; and a flat structure positioned between the first and second housing pieces.

The invention relates to a fiber clamp with a base plate and at least two clamping bodies arranged parallel to one another on the base plate, the clamping bodies being pressed towards one another in one direction by means of a tensioning device, so that a fiber that can be arranged between the base plate and the clamping bodies is between the base plate and the clamping bodies can be pinched.