An optical ferrule has a different thermal expansion coefficient than a substrate to which a optical device is mounted, the ferrule optically coupling the device to one or more optical fibers. The optical ferrule includes and/or a cradle in which the ferrule is mounted include lateral and longitudinal engagement feature that ensure alignment with the optical device at an operating temperature, the ferrule expanding relative to the substrate when transitioning to the operating temperature.

Provided are optical fiber alignment assemblies, comprising: a plurality of fiber channel members being arranged along a first vertical axis, each fiber channel member comprising a fiber channel configured to accommodate an optical fiber disposed therein, the plurality of fiber channels being parallel to one another, fiber channels adjacent to one another defining a spacing therebetween, the spacing being measured along the first vertical axis; a plurality of resilient members, a resilient member being disposed between adjacent fiber channel members; and an adjustment element, the adjustment element being configured to effect a force oriented along the first vertical axis, and the adjustment member being configured such that actuation of the adjustment member changes a compression of the plurality of resilient members so as to effect an essentially linear variation in the spacing between adjacent fiber channels. Also provided are related methods.

An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

A photonic integrated circuit (PIC) assembly that includes a PIC, and a light source mounted on a first carrier substrate, and optically coupled and aligned with the PIC. The first carrier substrate includes a wrap-around metal, that enables the first carrier substrate to be bonded electrically with the PIC using solder bumps, and wherein the wrap-around metal enables the first carrier substrate to be electrically controlled by an external device for facilitating alignment and optical coupling process with the PIC.

An optical axis alignment method may include the steps of taking an image of a lens holder and a holder base to obtain contour information before laser irradiation, detecting location information about a light path of a light beam which exits from a collimating lens, adjusting the position of the collimating lens by plastically deforming via laser irradiation, taking an image of a contour of a lens holder and a base member to obtain new contour information and detecting new location information about a light path of a light beam which exits from the collimating lens. If the accuracy is not within the predetermined allowable limits, the laser irradiation condition is corrected based on the contour information and/or the location information obtained both before and after the laser irradiation and the lens position adjustment is repeated.

A receptacle for transceiver optical sub-assembly is configured for optical elements such as a light-emitting unit, a light guide unit, a light-receiving unit and a filter to connect thereto. The receptacle includes a lower receptacle body having a through bore, to which the light-emitting unit is connected; and an upper receptacle body having an axial receiving bore, to which the light guide unit is connected. The upper and the lower receptacle body are movable relative to each other in the x-y plane. The lower receptacle body can be moved relative to the upper receptacle body until an optical signal emitted from the light-emitting unit is optically coupled and collimated with an optical fiber in the light guide unit, and then the upper and lower receptacle bodies are fixedly connected together.

An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.

Various techniques are provided for manufacturing an optical connector. In one example, a technique may include applying an optical adhesive to a first end of the optical fiber, translating the optical fiber towards a lens to at least partially adhere the end of the optical fiber to the lens by the optical adhesive, and suspending the lens from the optical fiber to align a center of gravity of the lens with an optical path of the optical fiber to maintain optical beam power loss below a power loss threshold. Additional methods, systems, and apparatus are also provided.

An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.