Aspects described herein include a method comprising arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The method further comprises aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die comprises rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

The disclosure relates to a retaining arrangement with a carrier platform (2), for example in laser systems, to which at least one optical element (3) is fixed. The disclosure specifies a retaining arrangement for optical elements which ensures improved beam position stability with as little effort as possible. For this purpose, the carrier platform (2) is connected to a base (8) at bearing points (5) via a respective elastically compliant and/or damping connecting structure (6). The connecting structure (6) is designed to elastically absorb thermal expansions of the carrier platform (2). The at least one optical element (3) is located at a neutral point (13) and/or on a neutral axis on the carrier platform (2), wherein this neutral point (13) or the neutral axis is positionally stable relative to the base (8) during thermal deformation of the carrier platform (2). The carrier platform (2) is connected to a heat sink or source (16) via an intermediate heat pump, for example in the form of a Peltier element (17), with a flexible, for example ribbon-shaped heat transfer element (15) without mechanical retroaction.

There is provided an optical axis alignment mechanism between the laser oscillator and the optical fiber. The laser oscillator emits laser light, which then emerges from the emission end of the optical fiber via the axis alignment mechanism. Part of the laser light is received on the light-receiving surface of the CCD camera of a laser light evaluator. Thus, the laser light evaluator acquires a light intensity distribution. The light intensity distribution is used by the optical axis alignment mechanism to align the axis of the laser oscillator with the axis of the optical fiber.

Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

The invention provides methods and devices for generating optical pulses in one or more waveguides using a spatially scanning light source. A detection system, methods of use thereof and kits for detecting a biologically active analyte molecule are also provided. The system includes a scanning light source, a substrate comprising a plurality of waveguides and a plurality of optical sensing sites in optical communication with one or more waveguide of the substrate, a detector that is coupled to and in optical communication with the substrate, and means for spatially translating a light beam emitted from said scanning light source such that the light beam is coupled to and in optical communication with the waveguides of the substrate at some point along its scanning path. The use of a scanning light source allows the coupling of light into the waveguides of the substrate in a simple and cost-effective manner.

A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

A light intensity modulator includes an input optical fiber; an output optical fiber; an optical arrangement having a lens, where the optical arrangement is configured to receive light from the input optical fiber, pass the light through the lens, and direct the light to the output optical fiber; and a piezoelectric device coupled to the lens, where the piezoelectric device is configured for moving the lens to alter overlap of the output optical fiber and the light directed to the output optical fiber to modulate intensity of light in the output optical fiber.

Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.