A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.

A curable resin or adhesive composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and at least one energy converting material, preferably a phosphor, capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

Apparatus and method for detachably connecting at least one optical fiber of a detachable photonic plug to a photonic integrated circuit (PIC). The detachable photonic plug comprises: a detachable plug die; an optically transparent spacer coupled to the detachable plug die; and at least one optical fiber held between the detachable plug die and the spacer. On the PIC side, apparatus includes a receptacle adapted to receive a detachable photonic plug adapted to couple at least one optical fiber to a photonic integrated circuit (PIC); and a photonic bump of the PIC, the photonic bump having a least one fine alignment feature. The method comprises permanently mounting a receptacle over at least a portion of the PIC; after completion of mounting, inserting the detachable photonic plug into the receptacle; and after the detachable photonic plug is inserted in the receptacle, securing the detachable photonic plug in the receptacle.

A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.

A photonic integrated optical device can implement hybrid integration of an optical functional element simply and easily using an optical circuit of a PLC as a platform and allows high accuracy butt-joining of optical waveguides. For that, on the side of an optical circuit on top of a substrate of the PLC, the device uses a butt-joint holding substrate that transmits light in the wavelength region ranging from the UV light band to the visible light band. A UV-cure adhesive is filled into a gap between an optical circuit of the PD and an optical circuit of the PLC and a gap between an end face of a substrate of the PD and an end face of the substrate. This allows a joint to be formed by the UV-cure adhesive filled into the gap between the butt-joining end faces and cured by UV light passing through the substrate.

A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.

An apparatus includes an installation tool for attaching an optical fiber to a structure. The tool includes a body. One or more contact portions are supported by the body and configured to secure the optical fiber. An adhesive dispenser is disposed proximate the body. The adhesive dispenser is configured to dispense at least one adhesive to the optical fiber and the structure. A dispenser controller is operatively coupled to the adhesive dispenser. The dispenser controller is configured to control the adhesive dispenser.

Disclosed is a method and system applicable to attaching a single or multiple optical fibers in sequence to a photonic integrated circuit enabling precise control of optical fibers and/or multiple types of optical fibers and/or at any pitch. The system and method provide optical alignment and in situ attachment of one or more optical fibers to a photonic integrated circuit chip using a photo-curable adhesive, wherein curing light is delivered to the adhesive by the optical fiber being attached.

A photonic integrated circuit (PIC) assembly that includes a PIC, and a light source mounted on a first carrier substrate, and optically coupled and aligned with the PIC. The first carrier substrate includes a wrap-around metal, that enables the first carrier substrate to be bonded electrically with the PIC using solder bumps, and wherein the wrap-around metal enables the first carrier substrate to be electrically controlled by an external device for facilitating alignment and optical coupling process with the PIC.

An optical module in which a space between a light emitting portion (or a light receiving portion) (11a) of an optical element (11) and an insulating layer (1) of an electric circuit board (E) is filled with a cured product of a light-transmissive resin composition containing a curing agent component including only a non-antimony-containing curing agent (i.e., an optical element bonding/reinforcing resin cured product (X)) and a junction between the optical element (11) and the electric circuit board (E) is reinforced with the cured product.