A compact, wavelength-stabilized laser source is provided by utilizing a specialty gain element (i.e., formed to include a curved waveguide topology), where a separate wavelength stabilization component (for example, a fiber Bragg grating (FBG)) is used one of the mirrors for the laser cavity. That is, the FBG takes the place of the physical “front facet” of the gain element, and functions to define the laser cavity in the first instance, while also utilizing the grating structure to impart the desired wavelength stability to the output from the packaged laser source. As a result, the FBG is disposed within the same package used to house the gain element and provides a wavelength-stabilized laser source in a compact form.

Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.

The invention is a connector structure for connecting optical conduits comprising a first connector part (11) and a second connector part (21) connectible to each other, the first connector part (11) comprises a head unit comprising a head portion (18) arranged with a conical receiving space part (35), a connector housing element (22), and a first resilient element (26) in an inner space of the connector housing element (22), and a first conduit channel adapted for arranging a first optical conduit is formed in the first connector part (11), and the second connector part (21) comprises a second head portion (16) having a spherical end portion adapted for being circularly seated on the conical side wall (30) of the conical receiving space part (35) of the first head portion (18) of the first connector part (11) in case the first connector part (11) is connected to the second connector part (21), and a second conduit channel adapted for arranging a second optical conduit is formed in the second connector part (21). The invention is, furthermore, a crimping device for securing an optical conduit into a connector part, a push-out device for removing an optical conduit from a connector part, and a light blocking element for a connector part.

An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.

An illumination apparatus, which is to be connected to a light source apparatus that generates laser light and which is to be attached to an optical cable that guides the laser light, is provided. The illumination apparatus includes a light-emitting module which is to be attached to a tip portion of the optical cable. The light-emitting module receives the laser light emitted from the optical cable, converts the laser light into light having a different wavelength of a predetermined color, and emits the light. A heat dissipating lens case includes a lens and dissipates heat generated by the light-emitting module. The lens controls distribution of the light emitted by the light-emitting module. The heat dissipating lens case includes an attachment structure which allows the heat dissipating lens case to be removably attached to the light-emitting module.

An optical measurement device 100 comprises a apparatus main element 1 including a light emission aperture 11, a light emission probe element 2 that includes the optical fibers 21 and transmits a light the other end 21b of the optical fibers 21 attached and detached relative the light emission aperture 11, and a light block element 6 that blocks the light irradiated from the light emission aperture 11 under the condition in which the light emission probe element 2 installed to the apparatus main element 1 is detached from the light emission aperture 11.

An optical transceiver performing the full-duplex transmission in a plural channel is disclosed. The optical transceiver provides an optical receptacle, a semiconductor optical device, an inner fiber that optically couples the optical receptacle with the semiconductor optical device, and a fiber tray that secures an extra length of the inner fiber. The fiber tray provides an inner wall inclined toward a direction perpendicular to a direction along which the inner fiber warps. The inner fiber is set within the space as touching the inclined inner wall and sliding thereon toward the inclined direction.

There is provided an optical module. The optical module includes a light source, a wave guide to which beam output from the light source is input, a lens system configured to optically combining the light source and the wave guide, a first lens mount positioned between the light source and the lens system in an optical axis of the light source, a first adhesive configured to fix the lens system to the first lens mount, a second lens mount positioned between the wave guide and the lens system in the optical axis of the light source, and a second adhesive configured to fix the lens system to the second lens mount. Therefore, it is possible to precisely align light, to manufacture the optical module with small expenses, and to simplify processes and equipment.

An optical device for implementing passive alignment of parts and a method therefor, more particularly an optical device and a method therefor that utilize an alignment reference part arranged on the substrate to passively align an optical element part with a lens-optical fiber connection part. For the passive alignment of parts, connection pillars of an alignment reference part are coupled to substrate holes, one or more light-emitting elements and one or more light-receiving elements are aligned in a row in a particular interval with respect to alignment holes arranged opposite each other in the alignment reference part, a lens-optical fiber connection part is aligned with respect to the alignment holes, and an optical fiber is aligned with the optical alignment point at a surface of a prism forming a portion of the lens-optical fiber connection part.

The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.