This optical receptacle comprises: a first optical surface through which light from a photoelectric conversion element is incident; a second optical surface through which the incident light is emitted to the optical transmitter side; an optical separation part which separates the incident light into monitor light that goes to a detection element and signal light that goes to the optical transmitter; and a third optical surface through which the monitor light is emitted to the detection element side. The securing part secures the optical transmitter such that the signal light from the second optical surface arrives at the end surface of the optical transmitter at a position farther than the focus of the second optical surface. The light flux diameter in the light separation part of the light incident through the second optical surface is smaller than the light flux diameter of the light in the second optical surface.

To provide an optical module and a method for aligning the optical module with which alignment can be easily performed. An optical module includes first optical element sections and a second optical element section optically joined to the first optical element sections. Each first optical element section includes an optical conversion element, a ferrule having a distal end being in contact with and optically joined to the second optical element section, and a first optical system disposed in a position where the ferrule and the optical conversion element are optically adjusted. The second optical element section includes joining sections in contact with and joined to, in joining parts, the distal ends of the ferrules, a wavelength multiplexing optical element optically joined to the optical conversion elements, and second optical systems respectively disposed in positions where the wavelength multiplexing optical elements and the joining parts are optically adjusted.

A fiber optic cable sub-assembly comprises a fiber optic cable including at least one optical fiber, a cable jacket that houses the optical fiber and at least one metal strength member. A collar is attached to an end portion of the metal strength member, wherein the optical fiber extends beyond an outer axial end of the collar. In another example a fiber optic cable assembly is fabricated from the fiber optic cable sub-assembly wherein a connector housing is attached to the collar, and an interface operably connects an end portion of the optical fiber to an active optical component within the connector housing. In further examples, methods of assembly for a fiber optic cable sub-assembly are provided along with using the sub-assembly for making a fiber optic cable assembly.

The present invention provides a semiconductor laser module with high reliability that has a simple structure that can prevent a resin for fixing an optical fiber from coming off. The semiconductor laser module 1 has a base plate 11, a semiconductor laser device 22 disposed on the base plate 11, an optical fiber 30 operable to transmit a laser beam emitted from the semiconductor laser device 22, a fiber mount 40 that projects from an upper surface 11A of the base plate 11, and a resin 50 for fixing the optical fiber 30 on the fiber mount 40. The resin 50 is formed so as to cover side surfaces 42A, 42B, 43A, and 43B of the fiber mount 40.

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.

An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs.

A light module for illuminating an outer component of a vehicle, including: a housing for fastening the light module to the vehicle; a cover mounted on the housing; an inner space delimited between the housing and the cover; a printed circuit board in the inner space; a light source on the printed circuit board and configured for emitting an illumination beam-; and a light guide in the housing facing the light source and extending outside the inner space for guiding the illumination beam along the outer component. The light guide includes an optical fiber extending outside the inner space and a lens positioned between the light source and an entry opening of the optical fiber, such that the illumination beam emitted by the light source is focalized toward the entry opening of the optical fiber. A process for manufacturing such light module is also described.

A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

An optical transducer for endoscope includes an optical element, an optical fiber, and a ferrule, the ferrule including a semiconductor substrate and a glass substrate, in which: the semiconductor substrate has an insertion hole penetrating therethrough; an optical fiber is inserted into the insertion hole; the semiconductor substrate has a trench connected with the insertion hole and having an opening in a side surface; the trench has a convex on a bottom surface; and when a distal end surface of the optical fiber is observed from an opening of side surface of the tech, at least a part of the distal end surface is shielded by the convex.

An optical sensor system comprising: (a) a light source for at least one optical sensor, the light source comprising at least, (i) an interposer having first and second opposing sides and defining at least one alignment aperture extending from the first opposing side to the second opposing side; (ii) at least one fiber disposed in the at least one alignment aperture, the at least one fiber having a first optical axis; (iii) at least one light emitting component mounted to the second opposing side and having a second optical axis coincident with the first optical axis, the light emitting component configured to emit light, at least a portion of which is coupled with the at least one fiber as coupled light; and (b) the at least one optical sensor optically coupled to the at least one fiber.