Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Provided is an optical connector. The optical connector includes an optical subassembly (OSA) substrate integrally formed, the OSA substrate including a bottom surface, a first support surface, and a second support surface, the first and second support surfaces being formed together at a height of a first level from the bottom surface and apart from each other; a light-emitting device arranged on the first support surface; a ball lens located on a first optical path of light emitted from the light-emitting device, the ball lens being arranged on the second support surface; an optical fiber arranged at a rear portion of the ball lens along the first optical path; an optical filter configured to spatially separate the first optical path from the light-emitting device and a second optical path from the optical fiber; and a light-receiving device located on the second optical path and arranged on the second support surface.

According to the disclosure, the optical connector may include one platform, and thus, may have a simplified structure and may be miniaturized, and at the same, time, optical components of the optical connector may be self-aligned.

The present disclosure generally relates to devices, which may be used in communication or optoelectronic modules for example, suitable for arrayed positioning of a plurality of fiber optical components. In one form, an optoelectronic module includes a printed circuit board (PCB) and at least one optical component array device including an array of laterally or radially spaced receptacles configured to receive an optical component. One or more of the receptacles includes a fused fiber optical component positioned therein. A recursive fiber may extend between an output of a first fused fiber optical component and an input of a second fused fiber optical component, and an optical fiber routing member may be coupled to the PCB and include a plurality of guides extending away from the PCB and defining a pathway for routing optical fibers relative to the PCB.

A wavelength division multiplexing device includes an alignment substrate configured to provide alignment between optical components of the device. The device includes a plurality of collimating lenses, and the alignment substrate includes a plurality of aligners. Each of the aligners is configured to place a respective one of collimating lenses in a predetermined position and a predetermined orientation with respect to the other collimating lenses. The alignment substrate thereby provides passive alignment of the collimating lenses with a designed optical path. The substrate may also include visual alignment markings that provide an indication of the placement of multi-layer thin film filters so that the filters define an actual optical path in alignment with the designed optical path, and integrated optical waveguides that provide an optical beam to each of the collimating lenses.

An opto-electric hybrid board capable of precisely mounting an optical element in a mirror position of an optical waveguide, there is provided an opto-electric hybrid board including: an electric circuit board having first and second surfaces and including terminals for mounting an optical element on the first surface; and an optical waveguide provided on the second surface of the electric circuit board and including a mirror for optical coupling to the optical element, wherein an alignment mark for identifying the position of an exit surface of light exiting via the mirror of the optical waveguide is formed on the first surface of the electric circuit board.

There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.

An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.

Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. The pluggable optical transceiver modules include an on-board application-specific integrated circuit (ASIC), optical transceiver, and an optical socket allowing a fiber to connect to the optical transceiver. Pluggable optical transceiver modules implement an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in manner that does not require the fiber jumper, while ensuring tight alignment tolerances. In some embodiments, optical transceiver modules are designed to achieve a direct opt-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, an adaptor is distinctly designed, directly connecting an external cable to the optical socket (eliminating the use of fiber jumper and faceplate connector in the module). In some embodiments, a rigid body opto-mechanical interface is used.

A method for assembling a beam combiner array including providing an array block having a back wall, a front surface and a plurality of aligned channels extending from the back wall to the front surface, where a bore extends through the back wall and into each channel, and providing a lens array including a plurality of lenses. The method further includes securing the lens array to the front surface of the block so that one of the lenses is aligned with each channel and threading a separate hollow core fiber through one of the bores in the back wall so that an end of the fiber is positioned within the channel. The method also includes aligning each fiber to the lens array so that a beam that propagates down the fiber is emitted into the channel, focused by the lens and emitted from the array as a collimated beam.

An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.