A receptacle with lens can be mounted to an optimum position without monitoring an optical power. In an optical module constructed by a photonic device, a photonic device pedestal mounting the photonic device thereto, a TO-CAN stem, a cap with window glass, and a receptacle with lens, the TO-CAN stem is fitted to the receptacle with lens, the receptacle with lens is provided with a lens which can obtain a predetermined coupling efficiency between the photonic device and an optical fiber mounted to the receptacle with lens, and the TO-CAN stem is fitted with no alignment and bonded and fixed to the receptacle with lens. Therefore, the optimum mounting position of the receptacle with lens is achieved only by the mounting accuracy of the photonic device and the parts dimensional tolerances of the TO-CAN stem and the receptacle with lens without directly monitoring the optical power from the photonic device.

An optical receptacle is disposed between a light-emitting element and an optical transmission member and configured to optically couple the light-emitting element and the optical transmission member, the optical receptacle including an incidence surface configured to allow incidence of light emitted from the light-emitting element; and an emission surface configured to emit, toward the optical transmission member, light entered from the incidence surface and travelled inside the optical receptacle, the emission surface being an inner surface of a recess. The emission surface includes a first emission surface having a substantially spherical cap shape, and a second emission surface contiguous with the first emission surface, the second emission surface having a shape of a side surface of a substantially frustum shape.

Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

An optical module includes a housing, a plurality of active optical components and a path changer component. The housing has an airtight chamber. The active optical components are provided in the airtight chamber. The path changer component is provided in the airtight chamber, and the path changer component is configured to change an optical path of at least one of the active optical components.

This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.

A receiver optical sub-assembly, a combo bi-directional optical sub-assembly, a combo optical module, an optical line terminal, and a passive optical network system, where the receiver optical sub-assembly includes a first transistor-outline can, where a light incident hole is disposed on the first transistor-outline can, and where a first demultiplexer, a first optical receiver, a second optical receiver, and an optical lens combination are packaged in the first transistor-outline can.

The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.

An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

An embodiment optical connector includes a fiber having a core through which light is guided and a magnet attached to one end of the fiber, and the magnet has an opening that exposes at least the end face of the core. An embodiment optical connection structure includes a first optical connector and a second optical connector, each including a fiber having a core through which light is guided and a magnet attached to one end of the fiber, wherein the magnets are magnetized so as to exert attraction on each other, and when the first optical connector and the second optical connector are mechanically connected by magnetic forces, the core of the first optical connector and the core of the second optical connector are optically connected through the opening of the magnet of the first optical connector and the opening of the magnet of the second optical connector.

An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.