In an optical module, optical signal output having satisfactory waveform and intensity can be obtained. A differential transmission line includes a first differential transmission line, which has a first characteristic impedance and is connected to a drive IC, a second differential transmission line, which has a second characteristic impedance and is connected to a light output element, the second characteristic impedance being smaller than the first characteristic impedance, and connecting portions configured to connect the first differential transmission line and the second differential transmission line in series with each other. A resistive element is arranged between the connecting portions. The resistive element has a resistance value that is set to a value with which an absolute value of a reflection coefficient for a signal traveling from the second differential transmission line side to the first differential transmission line side is 0.10 or less.

A method for manufacturing an electronic component includes preparing a mounting substrate provided with a first region to mount an electronic component thereon and a second region having conductivity, covering the second region with resin, applying a metal paste on the first region, mounting the electronic component on the first region with the metal paste, and removing the resin covering the second region. The mounting includes heating the mounting substrate to cure the metal paste with the electronic components being placed on the metal paste applied on the first region. The resin peeled from the second region by the heating is removed in the removing.

An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.

In an optical module, optical signal output having satisfactory waveform and intensity can be obtained. A differential transmission line includes a first differential transmission line, which has a first characteristic impedance and is connected to a drive IC, a second differential transmission line, which has a second characteristic impedance and is connected to a light output element, the second characteristic impedance being smaller than the first characteristic impedance, and connecting portions configured to connect the first differential transmission line and the second differential transmission line in series with each other. A resistive element is arranged between the connecting portions. The resistive element has a resistance value that is set to a value with which an absolute value of a reflection coefficient for a signal traveling from the second differential transmission line side to the first differential transmission line side is 0.10 or less.

An optical module includes an eyelet having a first surface, a second surface opposite to the first surface, and a penetration hole penetrating from the second surface to the first surface; a lead pin in the penetration hole, for transmitting electric signals; a pedestal protruding from the first surface in an extension direction of the lead pin; and a relay board on the pedestal, the relay board having a transmission line for electrically connecting an optical element and the lead pin. The lead pin is in no contact with an inner surface of the penetration hole. The lead pin has a flat surface which is at least a part of a surface bonded to the transmission line.

The present disclosure provides a TO-CAN cap. The TO-CAN cap includes a casing, the casing has a hollow cylindrical structure, and an inner wall of the casing has a protrusion portion at a first end portion in an axial direction of the casing; and an optical lens, the optical lens has an optical portion for refracting light and a rib portion at a periphery of the optical portion, a side surface of the rib portion having a concave portion complementary to the protrusion portion, where the casing and the optical lens are connected to each other through the protrusion portion and the concave portion.

This application provides an optical component including a base, a light splitting structure, a first filter, and a collimation lens, where a first optical signal on a first path is incident on a light splitting surface of the first filter through a light inlet/outlet; the light splitting surface of the first filter reflects the first optical signal to the collimation lens along a second path, where the collimation lens disposed on the second path is configured to convert the first optical signal on the second path into parallel light; and the first optical signal includes a signal of at least one type of wavelength, and the light splitting structure is disposed on an emergent path of the first optical signal after the first optical signal passes through the collimation lens, and is configured to output, based on the wavelength type, the first optical signal adjusted by the collimation lens.

Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

A hermetic optical fiber alignment assembly includes a ferrule portion having a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the ferrule portion. The assembly includes an integrated optical element for coupling the input/output of an optical fiber to the opto-electronic devices in the opto-electronic module. The optical element can be in the form of a structured reflective surface. The end of the optical fiber is at a defined distance to and aligned with the structured reflective surface. The structured reflective surfaces and the fiber alignment grooves can be formed by stamping.

A material for blocking crosstalk, an optical assembly, and a method for preparing the material are provided. The optical assembly includes an optical receive assembly, where a periphery of the optical receive assembly includes a transparent region and a non-transparent region; the transparent region is made of the material, where a first layer of film is located on a side opposite to an optical receiving direction, and a second layer of film is located on a side opposite to the optical receive assembly; and the non-transparent region is of an electrical-signal shielding structure.