There are included a CAN package (2) having a stem (22) and lead pins (23a and 23b) protruding from the stem (22), and a board (3) having pads (33a and 33b) for connecting lead pin. The CAN package (2) has a slot (222) provided in a surface of the stem (22) from which the lead pins (23a and 23b) protrude. One end of the board (3) is inserted into the slot (222), and the pads (33a and 33b) for connecting lead pin are electrically connected to the lead pins (23a and 23b).

A bidirectional optical module includes a TOSA, a ROSA and an optical filter. The TOSA includes a light emitting unit and a thin film LiNbOx modulator, and the thin film LiNbOx modulator is optically coupled with the light emitting unit. The ROSA is connected with the TOSA. The optical filter is provided for a fiber port which the TOSA shares with the ROSA.

A transistor outline (TO) package including a header with at least one optoelectronic device and a pot-shaped metal cap bonded to the header such that a hermetically sealed interior is formed for arranging the at least one optoelectronic device therein. The metal cap includes a window, which is transmissive to electromagnetic radiation, a lateral wall, and an end wall. A portion of the lateral wall and a portion of the end wall are formed with an increased thickness towards the interior compared to a portion of the lateral wall adjacent to the header. The thickened lateral wall portion and the thickened end wall portion have an identical wall thickness.

An optical module includes an eyelet having a first surface, a second surface opposite to the first surface, and a penetration hole penetrating from the second surface to the first surface; a lead pin in the penetration hole, for transmitting electric signals; a pedestal protruding from the first surface in an extension direction of the lead pin; and a relay board on the pedestal, the relay board having a transmission line for electrically connecting an optical element and the lead pin. The lead pin is in no contact with an inner surface of the penetration hole. The lead pin has a flat surface which is at least a part of a surface bonded to the transmission line.

A transistor outline (TO) package including a header with at least one optoelectronic device. The header is bonded to a pot-shaped metal cap, which has a window that is transmissive to electromagnetic radiation, such that the at least one optoelectronic device is arranged in a hermetically sealed interior. The wall of the metal cap has at least one lateral wall portion and/or end wall portion which is thickened towards the interior compared to a portion of the lateral wall of the metal cap adjacent to the header.

The present disclosure is generally directed to a stepped profile for substrates that support on board optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.

A multi-wavelength integrated device (5) including plural semiconductor lasers (6) and plural modulators (7) modulating output beams of the plural semiconductor lasers (6) respectively is mounted on the stem (1). Plural leads (10) penetrates through the stem (1) and are connected to the plural semiconductor lasers (6) and the plural modulators (7) respectively. Each lead (10) is a coaxial line in which plural layers are concentrically overlapped with one another. The coaxial line includes a high frequency signal line (12) transmitting a high frequency signal to the modulator (7), a GND line (14), and a feed line (16) feeding a DC current to the semiconductor laser (6). The high frequency signal line (12) is arranged at a center of the coaxial line. The GND line (14) and the feed line (16) are arranged outside the high frequency signal line (12).

The present disclosure provides a TO-CAN cap. The TO-CAN cap includes a casing, the casing has a hollow cylindrical structure, and an inner wall of the casing has a protrusion portion at a first end portion in an axial direction of the casing; and an optical lens, the optical lens has an optical portion for refracting light and a rib portion at a periphery of the optical portion, a side surface of the rib portion having a concave portion complementary to the protrusion portion, where the casing and the optical lens are connected to each other through the protrusion portion and the concave portion.

An optical subassembly may include a device mounting substrate on which an optical device is mounted, a relay substrate including a first conductor pattern transmitting a electrical signal to the optical device, a pedestal including a third surface on which the relay substrate is placed and a fourth surface on which the device mounting substrate is placed and a spacer interposed between the third surface and the relay substrate to electrically connect the relay substrate and the pedestal. In an optical subassembly, the first lead terminal may include a small-diameter part and a large-diameter part provided at an end of the small-diameter part and having a larger diameter than that of the small-diameter part, and at least part of the large-diameter part may be exposed from the dielectric on a first surface side and the first lead terminal and the first conductor pattern may be connected by brazing and soldering.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.