A coaxial transmitter optical subassembly (TOSA) including a ball lens may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The coaxial TOSA includes a laser package with a ball lens holder section defining a lens holder cavity that receives the ball lens. The lens holder cavity is dimensioned such that the ball lens is positioned in substantial alignment with the laser diode for optically coupling a laser output from the laser diode into an optical waveguide at an optical coupling end of the TOSA. The coaxial TOSA is thus configured to allow the less expensive ball lens to be used in a relatively small package when a lower coupling efficiency and power is desired and without substantial redesign of the TOSA.

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures. In this way, a longer life and better performance of the optoelectronic transducer may be achieved, and datacenter costs related to cooling and/or maintenance may be minimized.

A semiconductor package and the method for forming the same are provided. The semiconductor package includes an oxide layer, and a waveguide and a photonic component located on a first side of the oxide layer. The semiconductor package also includes a heater element adjacent to the photonic component and configured to provide thermal energy to the photonic component. The semiconductor package also includes a redistribution structure located on a second side of the oxide layer opposite the first side. The redistribution structure includes a plurality of dielectric layers and conductive features in the dielectric layers. In addition, the semiconductor package includes a thermoelectric cooling device embedded in the dielectric layers of the redistribution structure and located directly below the photonic component.

An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.

A method for assembling a photonic computing system includes attaching a photonic source to a support structure, and attaching a photonic integrated circuit to the support structure. The photonic source includes a first laser die on a substrate configured to provide a first optical beam, and a second laser die on the substrate configured to provide a second optical beam. The photonic integrated circuit includes a first waveguide and a first coupler coupled to the first waveguide, and a second waveguide and a second coupler coupled to the second waveguide. The method includes attaching a plurality of beam-shaping optical elements to the support structure, the substrate, or the photonic integrated circuit, in which the attaching includes aligning a first beam-shaping optical element during attachment so that the first optical beam is coupled to the first coupler, and aligning a second beam-shaping optical element during attachment so that the second optical beam is coupled to the second coupler.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.