A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.

An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.

A pixel circuit having a function of compensating for characteristic variation of an electro-optical element and threshold voltage variation of a transistor is formed from a reduced number of component elements. An input signal is sampled from a signal line so as to be held in a holding capacitor. The threshold voltage of the drive transistor is imparted to the holding capacitor in order to cancel an influence of the threshold voltage.

An optical engine includes a substrate provided with terminals configured to connect to a connector provided on another substrate, a light receiver/emitter mounted on the substrate, and a cover covering the substrate. The light receiver/emitter is any one of a light receiver, a light emitter, and an element having functions of both the light receiver and the light emitter.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.