A laser device includes: a plurality of collimating lenses collimate light emitted from the plurality of light sources; a plurality of holders each hold a pair of light sources and the collimating lens and which adjust emission positions and emission angles of the collimated light of the collimating lenses; a housing which holds the plurality of holders; a light condensing part which condenses each of the collimated light whose emission position and emission angle are adjusted; a heat exhausting member which exhausts heat generated from the plurality of light sources; and a heat transfer member which is disposed between the heat exhausting surfaces of the light sources and a heat absorbing surface of the heat exhausting member, includes an elastic part abutting against the heat exhausting surfaces and the heat absorbing surface, has heat conductivity, and transfers the heat from the heat exhausting surfaces to the heat absorbing surface.

A laser device has a plurality of laser diodes; a plurality of optical elements installed corresponding to the plurality of the laser diodes; a plurality of units formed by fixing the laser diodes and the optical elements per each laser diode and installed corresponding to the plurality of the laser diodes; a converging element that converges laser beams emitted from the plurality of the laser diodes to a fiber; a housing element houses the plurality of the units and the converging element; and a thermal transfer plate performs heat dissipation of the plurality of the units. The heat resistance reducing element having a heat resistance value that is smaller than a predetermined value is installed between the thermal transfer plate and each unit or the processing for reducing the heat resistance is performed.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

To provide an optical subassembly, an optical module, and an optical transmission equipment including simpler components. A first component with an optical semiconductor device mounted thereon that dissipates heat generated by the optical semiconductor device to outside, a second component in contact with the first component to form a box type housing, and a receptacle terminal that optically joined to the optical semiconductor device are provided, wherein the second component includes a window structure for transmitting light transmitted between the optical semiconductor device and the receptacle terminal, and the receptacle terminal is fused and fixed to the outside of the window structure.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

A distribution point unit for coupling an external electrical and optical cable comprises a casing comprising a first port to receive the external optical cable and a second port to receive the external electrical cable. The distribution point unit comprises an electronic board comprising electronic components and at least one heat transferring device. A tray comprises at least one hole to receive a section of the at least one heat transferring device. The at least one heat transferring device is thermally coupled to at least one of the electronic components to thermally couple the at least one electronic component to the casing.

An optical transceiver according to one embodiment includes a housing having an inner space and inner planes that face to each other and define the inner space, a TOSA including a package and a sleeve attached to the package, the sleeve being fixed to the housing, the package being housed in the inner space, a heat conductive gel that is plastic or deformable and closely sandwiched between the package and one of the inner planes, a fitting member in contact with the other of the inner planes and detachably fixed to the housing, and a resin member closely sandwiched between the package and the fitting member.

An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

A laser device includes: a plurality of collimating lenses collimate light emitted from the plurality of light sources; a plurality of holders each hold a pair of light sources and the collimating lens and which adjust emission positions and emission angles of the collimated light of the collimating lenses; a housing which holds the plurality of holders; a light condensing part which condenses each of the collimated light whose emission position and emission angle are adjusted; a heat exhausting member which exhausts heat generated from the plurality of light sources; and a heat transfer member which is disposed between the heat exhausting surfaces of the light sources and a heat absorbing surface of the heat exhausting member, includes an elastic part abutting against the heat exhausting surfaces and the heat absorbing surface, has heat conductivity, and transfers the heat from the heat exhausting surfaces to the heat absorbing surface.