An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.

A distribution point unit for coupling an external electrical and optical cable comprises a casing comprising a first port to receive the external optical cable and a second port to receive the external electrical cable. The distribution point unit comprises an electronic board comprising electronic components and at least one heat transferring device. A tray comprises at least one hole to receive a section of the at least one heat transferring device. The at least one heat transferring device is thermally coupled to at least one of the electronic components to thermally couple the at least one electronic component to the casing.

A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

In an example, an optoelectronic device may include a hermetic cavity, an optical component, a multilayer ceramic, and an electrical circuit. The optical component may be positioned inside the hermetic cavity. The multilayer ceramic may define at least one side of the hermetic cavity. The electrical circuit may be routed through the multilayer ceramic to electrically couple the optical component positioned inside the hermetic cavity to an electrical component positioned outside of the hermetic cavity.

A plurality of optical elements are provided in correspondence with a plurality of laser diodes, and make the plurality of beams emitted from the plurality of laser diodes parallel. A plurality of selective transmission elements are provided in correspondence with the plurality of optical elements and selectively transmit the beams emitted from the plurality of laser diodes or beams excluding an outer periphery portion of the beams emitted from the plurality of optical elements. One or more light traveling direction control members control light traveling directions of the plurality of beams having passed through the plurality of optical elements and the plurality of selective transmission elements so as to move the plurality of beams to the vicinity of an optical axis of the fiber. A light converging unit converges the plurality of beams emitted from the one or more light traveling direction control members to the fiber.

A phase shifter includes a substrate layer, a cladding layer, and a waveguide. The phase shifter includes a waveguide and a heating element. The phase shifter includes a thermally conductive structure disposed on the cladding layer to disperse heat from the waveguide. The thermally conductive structure may include a metal strip disposed longitudinally along the beam, may include thermally conductive pads, and/or may include thermally conductive vias coupled between the cladding layer and the substrate layer. The phase shifter may be incorporated into light detection and ranging (LIDAR) devices, telecommunications devices, and/or computing devices.

An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

An illumination apparatus, which is to be connected to a light source apparatus that generates laser light and which is to be attached to an optical cable that guides the laser light, is provided. The illumination apparatus includes a light-emitting module which is to be attached to a tip portion of the optical cable. The light-emitting module receives the laser light emitted from the optical cable, converts the laser light into light having a different wavelength of a predetermined color, and emits the light. A heat dissipating lens case includes a lens and dissipates heat generated by the light-emitting module. The lens controls distribution of the light emitted by the light-emitting module. The heat dissipating lens case includes an attachment structure which allows the heat dissipating lens case to be removably attached to the light-emitting module.