A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

Provided is an optical submodule which includes an optical transmission/reception module that optically couples an optical transmission signal and an optical reception signal into one optical fiber and a flexible printed circuit board (FPCB) mounted on the optical transmission/reception module that functions as an electrical signal interface with a main board, and an electrical signal line of an optical transmission channel for the optical transmission signal and an electrical signal line of an optical reception channel for the optical reception signal may be deployed on different sides of the FPCB.

A light emission assembly including: a substrate; at least two channels including: a driving assembly including a driving chip; an EML laser assembly including an EML laser chip; a first magnetic bead; a second magnetic bead; a DC blocking capacitor; a driving multiplexing pad for electrically connecting a first end of the first magnetic bead with a signal pad of the driving chip and a first end of the DC blocking capacitor, a second end of the first magnetic bead being connected to a first supply voltage; an EML multiplexing pad for electrically connecting a first end of the second magnetic bead with the EML laser chip assembly and a second end of the DC blocking capacitor, a second end of the second magnetic bead being connected to a supply voltage of the EML laser chip. The present disclosure also provides an optical module including the light emission assembly.

An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

An optical fiber holding structure includes: a structure main body having a prismatic shape; a through hole into which an optical fiber is inserted; a protruding portion having a columnar shape projecting from the structure main body and configured to be inserted into an opening portion of a substrate; and a contact portion configured to abut on a surface of the substrate to position an optical element and the optical fiber at a predetermined distance. The through hole is formed so as to penetrate from a surface of the structure main body through which the optical fiber is inserted to an end surface of the protruding portion, and at least one side surface of the structure main body is flush with at least one side surface of the protruding portion.

An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.

An optical module includes a substrate with a through-hole formed therein, an optical element member that includes a light receiving or emitting part that receives light or emits light at a position on a surface that is opposite to the substrate, the position corresponding to the through-hole, and a post that is formed of a transparent material, covers the light receiving or emitting part and is inserted into the through-hole.

An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.

An opto-electric hybrid board that achieves sufficiently lower noise for signal transmission, is less prone to cause warpage during the mounting of various elements, and has high-speed communication properties, an opto-electric hybrid board α including: an electric circuit board 1; an optical waveguide 2 formed in a stacked manner on a first surface 1a of the electric circuit board 1; and a reinforcement plate 3 for reinforcing the electric circuit board 1, wherein a surface of the optical waveguide 2 on the opposite side from a surface thereof contacting the first surface 1a of the electric circuit board 1 is covered with the reinforcement plate 3.

A flexible substrate includes: an insulating base member; a plurality of lands formed aligned in a plurality of lines in a first direction on the base member; and a plurality of wirings formed on the base member, extending in a second direction intersecting the first direction, and connected to the plurality of lands on each line of the plurality of lines, wherein the plurality of wirings include a wiring extending between the lands aligned in the first direction, and wherein each of the plurality of lands has a planar shape longer in the second direction.