The present disclosure provides a multi-channel parallel optical receiving device, including a carrier, a light receiving chip, a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier, an optical fiber connector disposed in another end of the carrier, and an arrayed waveguide grating disposed on the top surface of the carrier. The plurality of optoelectronic diodes is electrically connected to the light receiving chip, and an input end of the arrayed waveguide grating is connected to the optical fiber connector for receiving an optical signal from the optical fiber. The optical signals are divided into multi-channel optical signals in parallel. The top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals to be reflected by the top surface and to photosensitive surfaces of the optoelectronic diodes arranged in parallel.

An opto-electric hybrid board includes: an electric circuit board including an insulation layer and electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide provided on the back surface side of the insulation layer of the electric circuit board, with a metal layer therebetween. At least one opening is formed by removing at least part of a region of the metal layer which is overlaid on the contour of an end portion of the optical waveguide. The optical waveguide is formed, with part of the optical waveguide extending into the opening. The opto-electric hybrid board is favorably usable over a prolonged period because the end portion of the optical waveguide provided on the back surface side of the electric circuit board does not peel off the metal layer.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

An opto-electric hybrid board includes: an electric circuit board including an insulation layer haying front arid back surfaces, arid electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide having a substantially rectangular shape as seen in plan view and provided on the back surface of the insulation layer of the electric circuit board, with a metal layer therebetween. The optical waveguide has at least one end portion disposed in overlapping relation with the metal layer. The at least one end portion of the optical waveguide has corner portions. Each of the corner portions is radiused to have an arcuate shape or has a polygonal shape produced by arranging a plurality of obtuse-angled portions in a substantially arcuate configuration.

An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.

A flexible printed circuit board and optical network allocation device comprising same. The flexible printed circuit board comprises a circuit board body (1), a plurality of protruding interfaces (101) on the circuit board body, an adhesive layer (2) covering the upper surface of the circuit board body (1), components (102), and an uplink interface (103) used for information interaction with the components (102) on the circuit board body (1). Each protruding interface (101) is provided with an electronic label read/write interface (1011) used for reading electronic label information on an optical fiber head and an indicator (1012). The adhesive layer (2) is provided with an open window region (201) in the middle. The components (102) are immobilized on the upper surface of the circuit board body (1) and located in the open window region (201) of the adhesive layer, and are connected to the electronic label read/write interface (1011), the indicator (1012), and the uplink interface (103) respectively, used for controlling and monitoring the read/write information of the electronic label read/write interface (1011) and controlling on/off of the indicator (1012).

An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

An opto-electric hybrid board includes: an electric circuit board including electrical interconnect lines formed on the front surface of an insulation layer; a metal reinforcement layer formed partially on the back surface of the electric circuit board; an optical waveguide W configured to partially overlap the back surface of the electric circuit board E; and an second reinforcement layer formed on the back surface of the electric circuit board E. The second reinforcement layer allows the opto-electric hybrid board to have improved rigidity in a specific region and excellent handleability without incurring optical losses during optical coupling.

Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.

A coherent optical transceiver is disclosed. The coherent optical transceiver installs an integrated coherent receiver (ICR), an optical modulator, an intelligent wavelength tunable laser diode (i-TLD), a digital signal processor (DSP), a driver to drive the optical modulator, and so on within a compact housing. The ICR is connected to the printed circuit board (PCB) through flexible printed circuit (FPC) boards and mounted thereon through a holder. The holder forms a gap against the PCB, where the FPC boards pass through the gap and connected on the pads formed on the surface of the PCB beneath the holder.