An optical source that implements a wavelength tunable laser diode (t-LD) and a Mach-Zehnder (MZ) modulator within a single package is disclosed. The optical source, which outputs a modulated signal beam and a local beam of a continuous wave (CW), accompanies a control circuit mounted on several circuit boards. Only one of the circuit boards is rigidly mounted on the housing of the optical source. Rest of the circuit boards is moderately fixed to the housing through the rigidly fixed circuit board to suppress stresses caused in the housing and the circuit boards when the optical source is rigidly installed in the host system.

A photoelectric conversion assembly is proposed. The photoelectric conversion assembly comprises a photoelectric conversion module having an interposer, at least one optical element and an optical bench. The at least one optical element is configured on the interposer, and the optical bench is used to support for the interposer. A circuit board is used to support for the photoelectric conversion module, having metal pads for coupling the at least one optical element. An optical transmission component is used for transmitting light. An optical ferrule is used for engaging with the photoelectric conversion module and an optical transmission component. A plug is used for electrically connecting the circuit board.

An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

An optical module includes: a circuit board having a surface in which an electronic element is mounted; an optical waveguide array in which a plurality of optical waveguides are formed; an optical element in which an optical signal that is transmitted and received from and to the optical waveguide is input and that is mounted at a side surface of the circuit board; and a connection member that connects the optical element and the electronic element, wherein a connection portion of a side surface of the circuit board in which the connection member is received has a curved shape.

An optical transceiver module includes a package containing a light receiving element, a light emitting element, and an optical modulator configured to modulate light that is output from the light emitting element, a rigid circuit board including a control circuit provided on the rigid circuit board, the control circuit being configured to control at least one of the light receiving element, the light emitting element, or the optical modulator, and a flexible circuit board including a plurality of signal wires, wherein the rigid circuit board is connected to the package via the flexible circuit board, with a first surface of the rigid circuit board facing a first surface of the package, and the at least one of the light receiving element, the light emitting element, or the optical modulator is electrically connected to the control circuit via the plurality of signal wires.

An object is to provide an optical transceiver in which two single-core bidirectional optical communication devices are mounted on a single substrate. A first substrate includes an electric connector connected to an optical transmission apparatus, and a signal processing circuit processing electric signals that are input to and output from first and second optical transceiver modules. Components outputting a control signal to the signal processing circuit is mountd on a second substrate. A flexible printed circuit connects the first substrate to the first and second optical transceiver modules.

An optical subassembly includes an eyelet including a first through-hole penetrating from a first surface through a second surface; a first lead terminal, which is to be inserted into the first through-hole, and is configured to transmit an electric signal; a dielectric material, which is filled in a space between the first through-hole and the first lead terminal; a device mounting substrate, on which an optical device is to be mounted, and which includes a first conductor pattern configured to transmit the electric signal to the optical device; a metal block having mounted thereon the device mounting substrate; a temperature regulator placed between the metal block and the eyelet; a relay substrate including a second conductor pattern, which is configured to transmit the electric signal to the optical device; a seat, which protrudes from the first surface in a direction extended from the first through-hole, and has a third surface mounting the relay substrate; and a spacer interposed between the third surface and the relay substrate to establish conduction between a rear surface of the relay substrate and the seat.

A construction and configuration for the receiving function of a high speed optical communication system with reduced manufacturing cost and improved performance. In an aspect, mounting the cover and lens provides a self-alignment behaviour that advantageously positions the cover and the lens to be in the optimum position for the photodiode. An assembly of electronic components receives data using an optical fibre. In one aspect, the assembly includes a photodiode, an amplifier coupled to the photodiode, and a printed circuit board on which the photodiode and amplifier are physically mounted, The printed circuit board has areas of a first material to which components may be attached using a fixing agent, and areas of a second material to which components will not attach using the fixing agent. Conductive bond wires are configured to directly couple the amplifier and the photodiode to conductive traces on an opposite side of the printed circuit board. A cover is configured to cover the amplifier and the photodiode, and is physically attached to the printed circuit board to provide mechanical rigidity around the photodiode and the amplifier. The cover has an optically transparent aperture containing a lens configured to focus modulated light signals from a fibre onto the photodiode. The printed circuit board has areas of a first material and second material configured to fix a location of the cover by use of the fixing agent to align the lens to focus the light signals from the fibre onto the photodiode.

Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.