A container arrangement (100) is disclosed, which is preferably destined for pharmaceutical products. The container arrangement includes a container body (110) and a first wireless communication systems (210) composed of a NFC system (210) including an NFC antenna (141). The container arrangement further includes a first and/or a second sensing-switching arrangement (143; 280) configured to include a preset status inhibiting a standardized operability of the first wireless communication system (210). The first sensing-switching arrangement (143) is configured to deregulate its preset status upon an initial opening event and the second sensing-switching arrangement (280) is configured to deregulate its preset status upon an unloading event.

Disclosed is a secure semiconductor chip. The semiconductor chip is, for example, a system-on-chip. The system-on-chip is operated by connecting normal IPs to a processor core included therein via a system bus. A secure bus, which is a hidden bus physically separated from the system bus, is separately provided. Security IPs for performing a security function or handling security data are connected to the secure bus. The secure semiconductor chip can perform required authentication while shifting between a normal mode and a secure mode.

A dynamic transaction card that is manufactured using conductive plastic jumpers that will dissolve when in contact with a solvent used to tamper with the dynamic transaction card. Internal components of a dynamic transaction card may be manufactured using a synthetic or semi-synthetic organic material, such as, for example, plastics. These materials may be conductive to provide functionality to a dynamic transaction card, such as a connection between an integrated circuit and other card components such that when the materials dissolve, the connections are broken and the dynamic transaction card may be inactive due to the loss of various connections.

Systems and methods for providing fraud prevention inserts in a chip pocket of a card are provided. A chip fraud prevention system includes a device including a chip and one or more fraud prevention inserts. The chip, and the fraud prevention inserts, may be at least partially encompassed in a chip pocket.

Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.

A method for detecting tag tampering on an item located in a venue is provided. The method may include registering a first tag and a second tag with the item, wherein the first tag and the second tag are located on the item. The method may further include pairing the first tag and the second tag that are registered with the item. The method may further include, determining and registering a distance between the first tag and the second tag on the item. The method may further include detecting whether tag tampering occurs on the item, whereby detecting whether tag tampering occurs comprises detecting whether the first tag and the second tag are displaced from the registered distance between the first tag and the second tag associated with the item.

A system and a method of monitoring physical properties of a physical medium over time are provided herein. The method may include the following steps: embedding a plurality of acoustic sensors into a physical medium before curing thereof; transmitting an acoustic wave by at least one transmitter coupled to or embedded within said physical medium; repeatedly calculating, over different points of time, a travel time of said acoustic wave between the at least one transmitter and the plurality of acoustic sensors; and analyzing said travel times, to detect a change over time in physical properties of said physical medium associated with said travel time.

A method and an apparatus for detecting a modification of a compound, the modification occurring during a transient period. The method may include: coupling at least one substance portion comprising ferro elastic material to a compound, the substance portion being configured to change a polarization level thereof continuously in response to a strain gradient applied thereto over the a transient period which results in said modification; sensing a physical property of said substance portion affected by the polarization level of the substance portion, due to the modification; and determining, using a computer processor, the modification, based on the sensed physical property of the substance portion.

A semiconductor chip may comprise: a processor for processing data; a shield which includes a metal line and is arranged over an upper portion of the processor; a detection unit for comparing a reference signal with an output signal, which is outputted when the reference signal passes through the shield, so as to detect whether there has been a wiring change within the shield or not; and a controller for configuring the routing topology of the metal line to be in a first state, and changing the routing topology from the first state to a second state.

Embodiments of an active shielding device and method for active shielding are disclosed. In an embodiment, an active shielding device includes current sources configured to generate currents, an analog wire shield unit connected to the current sources, a current to voltage converter connected to the analog wire shield unit and configured to generate a voltage in response to the currents that are generated by the current sources, and a voltage comparator connected to the current to voltage converter and configured to compare the voltage that is generated by the current to voltage converters with a reference voltage.