An RFID module is disposed at a position where the RFID module is electromagnetically coupled to the conductor. An RFIC receives power induced by receiving an electromagnetic wave for power reception to output a transmission signal. A power reception coupling unit is electromagnetically coupled to the conductor to receive power. A transmission coupling unit is electromagnetically coupled to the conductor to output a transmission signal to the conductor.

An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor.

A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.

Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.

A method is provided for testing a card body with a metallic core layer for a contactless or dual-interface chip card, and a method is provided for manufacturing a contactless or dual-interface chip card. The method involves testing the functionality of the card body before the chip module employed for testing, or a corresponding chip module, is fixed into the cavity of the card body. A card body having impurities, a partial closure or full closure in the slot of its metallic core layer fails the test and is not used at all for fixing the chip module and for the subsequent manufacturing steps.

The present disclosure provides a card shaped mobile payment device, which includes a card shaped casing and an offline payment execution module configured for executing an offline payment operation and disposed in the card shaped casing. The offline payment execution module includes a display module, a security chip, an antenna unit and a central control unit. The display module is used for displaying card information; the security chip is used for generating a token information, which is time-sensitive, and executing a transaction procedure. The antenna unit is electrically connected to the security chip for providing the token information to a transaction device. The central control unit activates the security chip according to a received identity authentication result, and provides a card index information corresponding to the card information to the security chip, so as to access a stored card credential and generate the token information.

A method of forming a contactless transaction card. The method may include providing a card body, defining a window, and attaching an antenna assembly layer to the card body, where the antenna assembly layer includes an antenna, a set of curable connectors, disposed on a set of end regions of the antenna within the window, and a UV-transparent layer, supporting the antenna. The method may include providing a contactless chip module within the window on a first side of the antenna assembly layer, and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna via the curable connectors.

Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.

A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light input of the light guide.

A method of making a metallic credit card from an existing plastic credit card including the steps of cutting the existing plastic credit card from each side edge, peeling the plastic top layer from its bottom plastic substrate, removing its EMV chip, and attaching it to a metallic substrate. The metallic substrate can further be laser engraved with the user's personal information.