The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus (10) for compensating for radiation tolerance comprises: a voltage value acquisition unit (11) that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit (12) that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit (13) that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

A memory cell includes: a latch, powered by a first reference voltage and a second reference voltage different from the first reference voltage, and having a first connecting terminal and a second connecting terminal; a first programmable fuse, having a first terminal coupled to the first connecting terminal and a second terminal coupled to the second reference voltage; and a second programmable fuse, having a first terminal coupled to the second connecting terminal and a second terminal coupled to the second reference voltage.

This invention comprises a new way to connect a control, CK, and data, D, signal into a basic cross-coupled INV pair, and into certain other basic sequential logic circuits, to control the writing in of a new data value, D, into the sequential logic circuit cell. The invention concerns logic circuit in complementary metal-oxide-semiconductor (CMOS) technology. It connects additional p-type and n-type MOSFET devices in a novel manner to accomplish the desired control functions.

The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

An exemplary memory bit cell circuit, including a bit line coupled to an SRAM bit cell circuit and an NVM bit cell circuit, with reduced area and reduced power consumption, included in a memory bit cell array circuit, is disclosed. The SRAM bit cell circuit includes cross-coupled true and complement inverters and a first access circuit coupled to the bit line. The NVM bit cell circuit includes an NVM device coupled to the bit line by a second access circuit and is coupled to the SRAM bit cell circuit. Data stored in the SRAM bit cell circuit and the NVM bit cell circuit are accessed based on voltages on the bit line. A true SRAM data is determined by an SRAM read voltage on the bit line, and an NVM data in the NVM bit cell circuit is determined by a first NVM read voltage on the bit line.

An apparatus may include a first inverter and a second inverter cross-coupled between a first node and a second node to store a signal state represented by complementary voltages at the first node and the second node. The apparatus may further include a first path defined by the second inverter that includes an impedance element to resist a flow of charge suitable to change the signal state. The apparatus may further include the first inverter and a third inverter selectively cross-coupled between the first node and the second node to store a received signal state represented by the complementary voltages at the first node and the second node responsive to an assertion of a write enable signal.

A static random access memory (SRAM) or other bit-storing cell arrangement includes memory cells and a hierarchical bitline structure including local bitlines for subsets of the memory banks and a global bitline spanning the subsets. A keeper circuit for the global bitline is replaced by bias circuitry on output transistors of the memory cells.

A memory array for storing odd and even data bits of data words in alternate sub-banks to reduce multi-bit error rate is disclosed. The memory array alternates odd data bits of a first plurality of data words in consecutive columns a first sub-bank of first and second memory banks and even data bits of the first plurality of data words in consecutive columns of a second sub-bank of the first and second memory banks. For example, the lowest bits of each of N data words are stored in a first N consecutive columns of a first sub-bank. The second bits of the N data words are stored in the next N consecutive columns of a second sub-bank. The N data bits in each of the bit positions of the N data words are interleaved in corresponding column mux sets. Alternating odd and even bits between sub-banks reduces multi-bit soft errors.

A depletion-mode FeFET (“FeDFET”) is programmable to a first programmed state, under a first set of voltage biasing conditions, and to a second programmed state, under a second set of voltage biasing conditions. In both the first and second programmed states, the storage transistor has a threshold voltage that is not greater than 0 volts. A memory circuit may be organized as memory cells, with each memory cell including select transistors, transistor switches and FeDFETs in a static random-access memory (SRAM) cell configuration.

Apparatuses and methods including dice latches in a semiconductor device are disclosed. Example dice latches have a circuit arrangement that include a reduced number of circuits, such as transistors, and provides a compact layout. Operation of example dice latches and other dice latches may be controlled by separately provided control signals for loading and latching of data, and in some examples, for a reset operation. Example layouts include circuit elements aligned along a direction with at least one other circuit element offset from the other aligned circuit elements.