A memory device is provided. The memory device comprises a first plane and a second plane. The memory device further comprises a control circuit coupled to the first plane and the second plane. The control circuit is configured to: simultaneously initiate programming the first plane and the second plane; and in response to the first plane being successfully programmed, the second plane being unsuccessfully programmed, and a programming pulse count of the second plane being less than a predetermined programming pulse count value, keep programming the second plane and disable the first plane.

Upon detecting power loss during the process of programming multi-level cell (MLC) memory in a storage system, the storage system takes steps to prevent data loss. In one example, the controller sends a graceful shutdown command to the memory, in response to which the memory aborts the ongoing programming operation and stores data from data latches associated with unprogrammed memory cells in single-level cell (SLC) memory. The memory can also store data from programmed memory cells in the SLC memory. The data to be programmed in the MLC memory can be reconstructed prior to powering down the storage system or after the storage system is powered back up. The reconstructed data can then be programmed in the MLC memory.

A memory system according to an embodiment includes a first bit line, a source line, a first word line, a second word line, a first memory pillar and a control circuit. The control circuit performs a first verify operation to first and second memory cells, a second verify operation to the first memory cell, a third verify operation to the second memory cell and a write operation or a read operation with a lower voltage in accordance with a request from an external device.

Multi-state programming of non-volatile memory cells, where cells being programmed to different target states are programmed concurrently, is performed by modulating the program speed of each state using a controlled amount of state-dependent weak boosting in their respective channels. In one example, the channel boosting is controlled by using a multi-stair word line ramp in conjunction with raising of the voltage on bit lines at a time based on the corresponding memory cell's target state.

A non-volatile memory system includes one or more control circuits configured to program memory cells and verify the programming. The verifying of the programmed memory cells includes applying one or more voltages to perform boosting of a channel region associated with unselected memory cells, allowing the boosting of the channel region for a portion of time while applying the one or more voltages, preventing/interrupting the boosting of the channel region while applying the one or more voltages for a duration of time based on position of a memory cell selected for verification, applying a compare signal to the memory cell selected for verification, and performing a sensing operation for the memory cell selected for verification in response to the compare signal.

A non-volatile memory device includes a memory cell array including memory cells, a page buffer circuit including page buffers respectively connected to bit lines, a buffer memory, and a control logic configured to control a read operation on the memory cells. In the read operation, the control logic obtains valley search detection information including read target block information and word line information by performing a valley search sensing operation on a distribution of threshold voltages of the memory cells, obtains a plurality of read levels using a read information model by inputting the valley search detection information into the read information model, and performs a main sensing operation for the read operation.

A memory circuit and a memory programming method adapted to program flash memory are provided. The memory circuit includes a charge pumping circuit, a voltage regulator, a voltage sensor, and a plurality of switch circuits. The charge pumping circuit generates a pumping voltage and a pumping current. The voltage regulator is coupled to the charge pumping circuit and generates a programming voltage and a programming current to program the flash memory according to the pumping voltage and the pumping current. The voltage sensor is coupled to the voltage regulator to monitor a voltage value of the programming voltage. Each of the plurality of switch circuits includes a first terminal coupled to the voltage sensor and a second terminal coupled to the flash memory. A quantity of the plurality of switch circuits that are turned on is determined by the voltage value of the programming voltage.

A memory device includes a memory array of memory cells and control logic, operatively coupled with the memory array. The control logic is to perform operations, which include causing the memory cells to be programmed with an initial voltage distribution representing multiple logical states; causing the memory cells to be programmed with a subsequent voltage distribution representing a subset of the multiple logical states at a higher voltage than that of the initial voltage distribution, wherein the subset of the multiple logical states is compacted above a program verify voltage level for the subsequent voltage distribution; and causing a first program verify operation of the subsequent voltage distribution to be performed on the memory cells to verify one or more voltage levels of the subsequent voltage distribution.

Power regulation in an integrated memory assembly having control semiconductor dies and memory semiconductor is disclosed herein. A master control die regulates power usage by the integrated memory assembly. Each control die reports information about its expected power usage to the master control die. The master control die determines a plan that meets a power criterion for the integrated memory assembly. The plan may maximize the power usage in each time period, while staying within a power budget. The plan can include selecting which of the memory dies perform a memory operation (or phase of a memory operation) during a given time period. The master control die may send a die scheduling plan to each of the other control dies. Each die scheduling plan indicates when memory operations and/or phases of memory operations are to be performed.

A memory device and associated techniques provide a read recovery of data in case of a short circuit between word lines. When cells of a recovery word line WLrec are successfully programmed but cells of an adjacent work line WLrec+1 are not successfully programmed, the data of the cells of WLrec can be recovered. The cells of WLrec+1 are erased so that a low pass voltage on WLrec+1 is adequate to provide these cells in a conductive state during the recovery read of WLrec. Capacitive coupling between the word lines which shifts the apparent threshold voltage of the cells on WLrec is reduced so that a more accurate recovery read can be performed. Read voltages on WLrec can be upshifted compared to baseline read voltages.