G11C29/28

Semiconductor memory device and test method therefor

A semiconductor memory device includes a memory array including a plurality of memory cells arranged in a matrix form, a plurality of bit line pairs disposed in the columns of the memory cells, a plurality of word lines disposed in the rows of the memory cells, a write drive circuit adapted to transfer data to a bit line pair in a selected column in accordance with write data, and a control circuit that deselects the word lines during a test and drives a low-potential side bit line of the bit line pair in the selected column to a negative voltage level in accordance with the potentials of bit lines in the selected column.

TECHNOLOGIES FOR REDUCING LATENCY IN READ OPERATIONS
20170206023 · 2017-07-20 ·

Technologies for reducing latency in read operations include an apparatus to perform a read attempt of a target data set from a memory, to obtain a candidate data set. A controller performs the read attempt using an initial read parameter, such as an initial read reference voltage. The controller is also to determine a candidate ratio of instances of data values in a portion of the candidate data set, compare the candidate ratio to a predefined reference ratio, determine whether the candidate ratio is within a predefined range of the predefined reference ratio, and, in response to a determination that the candidate ratio is not within the predefined range, adjust the read parameter and perform a subsequent read attempt of the target data set with the adjusted read parameter.

Method of use time management for semiconductor device and semiconductor device including use time managing circuit

A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Method of use time management for semiconductor device and semiconductor device including use time managing circuit

A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Memory circuit with assist circuit trimming

A memory device includes: a memory array comprising a plurality of bits, wherein a first bit of the plurality of bits is coupled to a first assist circuit; a test engine, coupled to the memory array, and configured to examine whether each bit is functional; and an assist circuit trimming (ACT) circuit, coupled to the memory array and the test engine, and in response to the examination, configured to selectively activate the first assist circuit.

Built-in self-test circuits for memory systems having multiple channels

A memory system includes a plurality of memory devices having respective arrays of memory cells therein, a bus electrically coupled to and shared by the plurality of memory devices, and a memory controller. The memory controller, which is electrically coupled to the bus, includes a built-in self-test (BIST) circuit, which is commonly connected to the plurality of memory devices. The BIST circuit is configured to transfer a command set including a test pattern to the plurality of memory devices via the bus, and transfer a command trigger signal for driving the test pattern to the plurality of memory devices via the bus.

Built-in self-test circuits for memory systems having multiple channels

A memory system includes a plurality of memory devices having respective arrays of memory cells therein, a bus electrically coupled to and shared by the plurality of memory devices, and a memory controller. The memory controller, which is electrically coupled to the bus, includes a built-in self-test (BIST) circuit, which is commonly connected to the plurality of memory devices. The BIST circuit is configured to transfer a command set including a test pattern to the plurality of memory devices via the bus, and transfer a command trigger signal for driving the test pattern to the plurality of memory devices via the bus.

MEMORY DEVICE WITH VARIABLE TRIM PARAMETERS

A memory device comprising a memory array comprising a plurality of memory cells, two or more fuses coupled to the memory array, wherein each of the two or more fuses contains trim data for the memory array and a mode register for selecting one of the two or more fuses to be enabled.

FAST SOFT DATA BY DETECTING LEAKAGE CURRENT AND SENSING TIME

Systems and methods for low latency acquisition of soft data from a memory cell based on a sensing time and/or a leakage current are described. In one embodiment, the systems and methods may include applying a first read voltage to a word line of a page of memory cells selected by a processor of a flash memory device for a read operation, applying a pass voltage to word lines associated with one or more different pages of memory cells of the memory block, upon applying the first read voltage sensing whether a bit line of a memory cell in the selected page conducts, measuring a side effect associated with sensing whether the bit line of the memory cell in the selected page conducts, and assigning a LLR value to the memory cell as a soft LDPC input based at least in part on the measured side effect.

CALIBRATION METHOD AND DEVICE FOR DYNAMIC RANDOM ACCESS MEMORY
20170103797 · 2017-04-13 ·

A calibration method and a calibration device for dynamic random access memory are provided. The calibration method for the dynamic random access memory includes: performing a calibration on the dynamic random access memory; and storing a calibration result generated during the calibration into a data structure so that the calibration result can be read from the data structure; wherein the data structure includes: a calibration result data region, recording the calibration result generated by performing the calibration on the dynamic random access memory. In the calibration method, the boot time of the present invention can be greatly saved.