G11C2029/3202

INTEGRATED CIRCUIT, TEST METHOD FOR TESTING INTEGRATED CIRCUIT, AND ELECTRONIC DEVICE
20210083672 · 2021-03-18 · ·

An integrated circuit of an embodiment includes: a logic circuit; and a switch circuit, the logic circuit including: a first memory; a look-up table circuit having a first output terminal; a first selection circuit having a first input terminal connecting to the first output terminal, a second input terminal receiving scan input data, and a second output terminal, the first selection circuit selecting one of the first and second input terminals and connect the selected one to the second output terminal; a flip-flop having a third input terminal connected to the second and third output terminals; and a second selection circuit having a fourth and fifth input terminals connected to the third output terminal and the first output terminal respectively, and a fourth output terminal, the second selection circuit selecting one of the fourth and fifth input terminals and connect the selected one to the fourth output terminal.

Fault injection architecture for resilient GPU computing

Unavoidable physical phenomena, such as an alpha particle strikes, can cause soft errors in integrated circuits. Materials that emit alpha particles are ubiquitous, and higher energy cosmic particles penetrate the atmosphere and also cause soft errors. Some soft errors have no consequence, but others can cause an integrated circuit to malfunction. In some applications (e.g. driverless cars), proper operation of integrated circuits is critical to human life and safety. To minimize or eliminate the likelihood of a soft error becoming a serious malfunction, detailed assessment of individual potential soft errors and subsequent processor behavior is necessary. Embodiments of the present disclosure facilitate emulating a plurality of different, specific soft errors. Resilience may be assessed over the plurality of soft errors and application code may be advantageously engineered to improve resilience. Normal processor execution is halted to inject a given state error through a scan chain, and execution is subsequently resumed.

SEMICONDUCTOR DEVICE
20210073101 · 2021-03-11 · ·

A semiconductor device capable of monitoring a connection state of a terminal on a semiconductor chip includes a selector configured to acquire terminal levels of a plurality of respective terminals on the semiconductor chip to which an inspection pattern is inputted based on a detection signal, a memory configured to store latch data based on a chip address which identifies the semiconductor chip and a plurality of the terminal levels corresponding to the plurality of terminals based on the detection signal, an output circuit configured to read a plurality of pieces of latch data from the memory based on the detection signal and to output the plurality of pieces of latch data, and a timing control circuit configured to generate the detection signal by detecting an edge of a clock inputted during an inspection mode and configured to activate the selector, the memory, and the output circuit.

SEQUENTIAL ERROR CAPTURE DURING MEMORY TEST
20210074375 · 2021-03-11 ·

Embodiments of the present invention are directed to methods, systems, and circuitry for memory arrays. A system for testing a memory array having self-test circuitry includes a register having register latches operable to receive error logic signals having respective first states or second states. The register latches are arranged in series having respective latch inputs cascaded with preceding latch outputs operable to shift the error logic signals to a serial output according to a control signal that is common to the register latches. The system includes an aggregate latch operable to receive the serial output and having input logic configured to maintain a first state of the aggregate latch until the serial output is a second state. The system includes a built-in self-test (BIST) engine including stored instructions operable upon execution by the BIST engine to output the control signal.

SYSTEM INCLUDING HIERARCHICAL MEMORY MODULES HAVING DIFFERENT TYPES OF INTEGRATED CIRCUIT MEMORY DEVICES
20210035652 · 2021-02-04 ·

Volatile memory devices may be on a first memory module that is coupled to a memory controller by a first signal path. A nonvolatile memory device may be on a second memory module that is coupled to the first memory module by a second signal path. A memory transaction for the nonvolatile memory device may be transferred from the memory controller to at least one of the volatile memory devices using the first signal path and data associated with the memory transaction is to be written from at least one of the volatile memory devices to the nonvolatile memory device using the second signal path and a control signal. A durability circuit may generate the control signal based on a comparison of a number of write transactions to a particular memory location with a threshold value.

CONTROLLER STRUCTURAL TESTING WITH AUTOMATED TEST VECTORS
20210208199 · 2021-07-08 ·

A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.

APPARATUSES AND METHODS FOR SOFT POST-PACKAGE REPAIR
20210020261 · 2021-01-21 · ·

Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.

Test access port architecture to facilitate multiple testing modes
10867689 · 2020-12-15 · ·

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

Apparatuses and methods for soft post-package repair
10832791 · 2020-11-10 · ·

Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.

Semiconductor circuit, control method of semiconductor circuit, and electronic apparatus
10818369 · 2020-10-27 · ·

A semiconductor circuit of the disclosure includes: a sequential circuit unit including a plurality of logic circuit units that include respective flip flops and respective non-volatile storage elements, the sequential circuit unit performing, in a first term, store operation in which the storage elements in the plurality of the logic circuit units store respective voltage states in the plurality of the logic circuit units, and shift operation in which the flip flops in the plurality of the logic circuit units operate as a shift register; and a first memory that stores, in the first term, first data or second data, the first data being outputted from the shift register by the shift operation, and the second data corresponding to the first data.